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Ni/Pd/Au finishing lead failed dipping solderability, possible causes

Hi all,

We have a part that failed the initial dipping solderability test. Symptoms are, we have a few leads in between good leads with solder good paste coverage, having NO solder paste sticking on them, not even at the cut/exposed copper surface of the lead. Cleaning have been done using Plasma & DI water jet, but the result was the same. Could it be caused by insufficient flux coverage, Cu migration, thick Gold plating, surface oxidation or others ?

SENG, SENGSOON
- KUALA LUMPUR, SELANGOR, MALAYSIA
2003

2007

I have some solderability issue with components NiPdAu made in Malaysia.
I want to exchange on this subject .
I think may be is it a relation with the Pd Thickness ?

Christian

Christian DEVRAY
THALES - Verrieres le buisson FRANCE

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