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Dendrites phenomena with immersion silver finishes on PCBs

I study the immersion silver finish of copper in the PCB, and I would have to know if the dendrites phenomenon (electromigration) is the only problem with the silver use or if there are others problems less known.

The immersion silver finish is a layer very fine, and I would have to know if during the PCB storage (before manufacturing process), the copper could diffuse in the silver layer and come in the silver surface, and decrease the copper's solderability?

Fallourd Ludovic
- Limoges, France
2003

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