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Autocatalytic plating of Sn on Au bumps for microelectronics

Is there existence of an article or knowledge of industrial process to deposit Sn on Au Bumped Wafers with IC's by means of autocatalytic plating?

Armand Doornveld
Philips Semiconductors - Zurich, Switzerland
2003

I DON'T KNOW AUTOCATALYTIC SN TO PLATE ON AU BUT YOU CAN PLATE SN ELECTROLITICALLY IMMEDIATELLY AFTER YOU FINISHED TO PLATE THE AU BUMP. YOU STILL HAVE ALL THE ELECTRICAL CONNECTIONS ON THE OTHER SIDE OF THE BUMP.

WE DID 70 MICRONS OF GOLD AND 5-7 MICRONS OF TIN IN THIS WAY.

Ricardo Burstein
Bnei Berak, Israel
2003

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