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Copper plating titanium nitride

1998

Q. I am currently trying to copper plate TiNi and am having a problem with adhesion at the interface. The solution I am using is an acid bath, at a low current density, and a copper electrode from a commercial acid bath.

How can I get a better adhesion?

I have already tried annealing and pumping argon through the bath.

Gabriel Wright

A. Hi, I'm working as process eng, for plating processes and I will be interested to exchange opinion and experiences.

Paolo Alagna
- Kalispell Montana
1999

Ed. note: Paolo, we think the ball remains in your court :-)

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