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topic 1908

Copper plating titanium nitride



1998

I am currently trying to copper plate TiNi and am having a problem with adhesion at the interface. The solution I am using is an acid bath, at a low current density, and a copper electrode from a commercial acid bath.

How can I get a better adhesion?

I have already tried annealing and pumping argon through the bath.

Gabriel Wright


1999

Hi, I'm working as process eng,for plating processes and I will be interested to exchange opinion and experiences.

Paolo Alagna
- Kalispell MT

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