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Copper plating titanium nitride
1998
Q. I am currently trying to copper plate TiNi and am having a problem with adhesion at the interface. The solution I am using is an acid bath, at a low current density, and a copper electrode from a commercial acid bath.
How can I get a better adhesion?
I have already tried annealing and pumping argon through the bath.
Gabriel Wright
A. Hi, I'm working as process eng, for plating processes and I will be interested to exchange opinion and experiences.
Paolo Alagna
- Kalispell Montana
1999
Ed. note: Paolo, we think the ball remains in your court :-)
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