After exposing and developing processes, I want to use the 1.6 micron photoresist layer as a mask to etch 1 micron silicon dioxide with RIE system. But I am not sure the 1.6 micron thickness of AZ
3612 Shipley photoresist can be strong enough for my etching process. Please help me with your experiences.
Thanks so much for your help.
Nguyen Hanh Thao Hanoi University of Technology - Vietnam
My name is Tom Le, I'd to have more info. and then help you out on your question.
PS: Tom is also a Vietnamese guy.
Tom Le - Sunnyvale, California, USA
finishing.com is made possible by ... this text gets replaced with bannerText
(No "dead threads" here! If this page isn't currently on the Hotline your Q, A, or Comment will restore it)
Disclaimer: It's not possible to fully diagnose a finishing problem or the hazards of an operation via these pages. All information presented is for general reference and does not represent a professional opinion nor the policy of an author's employer. The internet is largely anonymous & unvetted; some names may be fictitious and some recommendations might be harmful.
If you are seeking a product or service related to metal finishing, please check these Directories: