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Semiconductor photoresist process

2002

Dear everyone,

After exposing and developing processes, I want to use the 1.6 micron photoresist layer as a mask to etch 1 micron silicon dioxide with RIE system. But I am not sure the 1.6 micron thickness of AZ 3612 Shipley photoresist can be strong enough for my etching process. Please help me with your experiences.

Thanks so much for your help.

Nguyen Hanh Thao
Hanoi University of Technology - Vietnam
publicly reply to Nguyen Hanh Thao

Hi Thao,

My name is Tom Le, I'd to have more info. and then help you out on your question.

PS: Tom is also a Vietnamese guy.

Tom Le
- Sunnyvale, California, USA
2003
publicly reply to Tom Le

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