finishing.com -- The Home Page of the Finishing Industry

HomeFAQsSuggested
Books
Help
Wanteds
Advertise
on this site
FORUM
current topics

60,000 Q&A topics -- Education, Aloha, & Fun

topic 17767

Semiconductor photoresist process


2002

Dear everyone,

After exposing and developing processes, I want to use the 1.6 micron photoresist layer as a mask to etch 1 micron silicon dioxide with RIE system. But I am not sure the 1.6 micron thickness of AZ 3612 Shipley photoresist can be strong enough for my etching process. Please help me with your experiences.

Thanks so much for your help.

Nguyen Hanh Thao
Hanoi University of Technology - Vietnam


2003

Hi Thao,

My name is Tom Le, I'd to have more info. and then help you out on your question.

PS: Tom is also a Vietnamese guy.

Tom Le
- Sunnyvale, California, USA

adv.   accurate anodizing banner   

Q, A, or Comment on THIS thread SEARCH for Threads about ... My Topic Not Found: Start NEW Thread

Disclaimer: It's not possible to diagnose a finishing problem or the hazards of an operation via these pages. All information presented is for general reference and does not represent a professional opinion nor the policy of an author's employer. The internet is largely anonymous & unvetted; some names may be fictitious and some recommendations may be deliberately harmful.

  If you need a product/service, please check these Directories:

JobshopsCapital Equip. & Install'nChemicals & Consumables Consult'g, Train'g, SoftwareEnvironmental Compliance


©1995-2020 finishing.com, Inc., Pine Beach, NJ   -   About finishing.com   -  Privacy Policy
How Google uses data when you visit this site.