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Ted Mooney, P.E. RET

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Plating of copper onto aluminium balls w/o dilution of electrolyte

HOW CAN COPPER BE PLATED ON SMALL DIAMETER ALUMINIUM BALLS (1.0 mm) WITHOUT DILUTING THE CONCENTRATION OF copper sulphate ⇦ this on eBay or Amazon [affil links] ELECTROLYTIC SOLUTION ? WE ARE USING PURE COPPER AS AN ANODE IN THE ELECTROPLATING PROCESS.

Bhanjibhai Agola
- MORBI, GUJARAT, INDIA
2002

Although phosphorized anodes might help somewhat, Bhanjibhai, I think the principal problem may be aluminum dissolving into the solution by immersion plating. Making sure that you have hot entry should help.

Ted Mooney, P.E.
Striving to live Aloha
finishing.com - Pine Beach, New Jersey
2002

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