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Plating of copper onto aluminium balls w/o dilution of electrolyte

2002

HOW CAN COPPER BE PLATED ON SMALL DIAMETER ALUMINIUM BALLS (1.0 mm) WITHOUT DILUTING THE CONCENTRATION OF COPPER SULPHATE ELECTROLYTIC SOLUTION ? WE ARE USING PURE COPPER AS AN ANODE IN THE ELECTROPLATING PROCESS.

Bhanjibhai Agola
- MORBI, GUJARAT, INDIA

2002

Although phosphorized anodes might help somewhat, Bhanjibhai, I think the principal problem may be aluminum dissolving into the solution by immersion plating. Making sure that you have hot entry should help.

Ted Mooney, P.E.
Striving to live Aloha
finishing.com - Pine Beach, New Jersey

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