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Plating of copper onto aluminium balls w/o dilution of electrolyte
HOW CAN COPPER BE PLATED ON SMALL DIAMETER ALUMINIUM BALLS (1.0 mm) WITHOUT DILUTING THE CONCENTRATION OF COPPER SULPHATE ELECTROLYTIC SOLUTION ? WE ARE USING PURE COPPER AS AN ANODE IN THE ELECTROPLATING PROCESS.
- MORBI, GUJARAT, INDIA
Although phosphorized anodes might help somewhat, Bhanjibhai, I think the principal problem may be aluminum dissolving into the solution by immersion plating. Making sure that you have hot entry should help.
Ted Mooney, P.E.
Pine Beach, New Jersey
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