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-----Initiating E-Ni onto E-coppered surface
Dear Sir,
We have one question on EMI plating solution in between copper layer and nickel layer. So what is your formula or suggestion for the nickel initiator for electroless nickel to plated on electroless copper layer?
Thank you in advance and your reply.
Warmest regards,
Gem Spektra - Sg Petani, Kedah, Malaysia
2002
For EMI shielding plating you need a palladium containing solution between the copper and the EN.

Sara Michaeli
Tel-Aviv-Yafo, Israel
2002
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