Summary for tin whisker growth Discussion
Tin whisker growth is the focus of this thread, where Mark Boone asks for research on whisker growth from a bright acid tin plating process. The reply says there is a substantial body of literature, noting that a computerized search of the Metal Finishing Information Service found about 20 electroplating-journal articles with “whiskers” in the title. The practical explanation given is that electrodeposited tin, like some other metals, contains internal stresses, and whiskers are believed to grow as the deposit tries to relieve that stress. The answer also points to possible partial or total remedies, including stress-relief reflowing and alloy plating. No single cure is claimed, but the discussion frames whisker growth as a stress-related plating problem with several mitigation approaches.
Q. I am looking for any information on research on whisker growth when using a bright acid tin plating process.
Mark Boone
1998
Hi Mark,
A large amount of research is available; a quick computerized literature search through the Metal Finishing Information Service showed some 20 articles with ‘whiskers’ in the title in electroplating industry journals alone.
But the short version is that electrodeposited tin (and several other metals) have internal stresses, and it is believed that this force powers the growth of the whiskers in an attempt to reduce the stress. Partial or total cures can involve stress relief reflowing and alloy plating. Good luck.
Ted Mooney, P.E.
Striving to live Aloha
finishing.com – Pine Beach, New Jersey
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NASA has a page on tin whiskers at: https://nepp.nasa.gov/whisker/
Kirk Mueller
Raytheon Systems Co. – Los Angeles, California
2000