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Silver migration testing on a printed circuit board

What is the best method to test a printed circuit board for Silver Migration? UL has a standard to test to, UL 796, is this the best test or are there others, such as in a Mil spec. or even a commercial spec.? Maybe one of you knows a method that is very good but is not a specification.

David Chianese
STR - Enfield, Connecticut, USA
2002

A quick and efficient test is called Water Drop test. Connect with water drop anode and cathode suspected to participate in silver migration and apply potential. If migration is to occur (from anode to cathode) dendrite will grow in few seconds with sufficient bias. Not tried on PCB but wafer or packaged devices.

stephanie fossat-dominguez
- Temecula, California, USA
2003

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David,

Have you received a response on the water drop test from Stephanie Fossat-Dominquez. If so, do you have a reference for how this testing is done?

Richard Olson
Aveka, Inc. - Woodbury, MN, USA
2003

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An Industry Standard available for Silver Migration is (IPC F1996-01) This standard applies to a Standard Test Method for Silver Migration. It is written for testing Membrane Switches, but it might be of some assistance for PWB's as well.

Good luck,

Gordon Skiba
- Plymouth, MN, USA
2004