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-----Dependence of deposited mass on temperature during electroplating
I am a final year student at the high school Galashiels Academy. Can anyone tell me definitively the relationship between temperature and the mass deposited on a copper electrode in a bright acid copper bath with 2 copper electrodes?
Eoin Gould- Galashiels, Borders, Scotland
by William Safranek
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No, Eoin, I don't think anybody can. While higher temperatures mean more ion mobility and therefore increased plating speed, many other variables are much more important (like voltage, current density, agitation, solution conductivity and concentration). Further, practical plating temperatures are limited by the stability of the plating additives. The result of all this is that temperature really isn't a variable which ones does anything with except hold to the recommended value. You may wish to review "The Properties of Electrodeposited Metals and Alloys" by William Safranek .
Good luck.
Ted Mooney, P.E.
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