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immersion copper on tungsten

1998

How do immersion plate copper on tungsten? The tungsten is refractory thick film screen printed and fired at 1600C in a hydrogen atmosphere.

thanks
mike

michael de luca
nhi

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1997

It may be possible to immersion deposit Cu from any of the standard plating baths if you waste no time between removing the ceramic from the H₂ furnace and place it in the immersion bath directly to avoid oxidation of the Tungsten. The immersion bath should be dilute in terms of copper. You can contact Macdermid, Technic, or Shipley for formulations. Realize that immersion deposits rarely grow up over 10 microinches. If your layering can stand a slight bit of Palladium in the interface, you can immersion deposit Palladium via PdCl₃ solution from the above suppliers over the Tungsten, then follow with electroless Copper to your desired thickness.

good Luck,

Dave,

Dave Kinghorn
Chemical Engineer
SUNNYvale, California

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I am having trouble w/ adhesion on tungsten. I activate the piece in sodium persulphate and sodium hydroxide, flash it w/ woods Ni, then 100 microinches of pure gold. Adhesion problems come when the piece is soldered in air free atmosphere at 320c. Does anyone have suggestions?

Mark Walters
- New Brunswick, NJ
2001

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