netneut
finishing.com -- The Home Page of the Finishing Industry
A website for Serious Education, promoting Aloha,
& the most FUN smiley you can have in metal finishing


Finishing.com has been free for 22 years,
but without net neutrality we could soon
cease to exist. Do us a solid, click on
the banner, and contact congress today!
HomeFAQsBooksHelpWantedAdvertiseForum
topic 1385

Bubbling of tin plating


(1998)

We manufacture some small tin plated brass terminals for a particular customer. They are experiencing for the first time, bubbling of the plating during their plating operation. Does anyone know the possible cause of this?

Scott Niggemann



(1997)

It could be lead in the brass which is causing adhesion problems if the pretreatment step is incorrect. Could it be that the material has changed?

pooky
tom pullizi signature
Tom Pullizzi
Falls Township, Pennsylvania

(1998)

There are a number of factors which could lead to the bubbling of tin-plating. First of all, full surface cleaning is essential. Any oily spots or other dirt will definitely cause the bubbling problem. Organic or metallic contaminants in the plating both are another case resulting in the bubbling. Overplating also causes the bubbling. Poor connection leads to bad current distribution which results in partial bubbling. If acid bath is used, the low pH will bring about the bubbling.

Ling Hao
- Grand Rapids, Michigan


(1997)

Correction: They are experiencing bubbling during their soldering operation. Sorry about the mistake.

Scott Niggemann



(1997)

It could still be the same problem, only the adhesion problem doesn't manifest itself until a severe test such as soldering. The precleaning cycle may be correct, but temperatures, concentrations, impurities, might be out of control.


Tom Pullizzi
Falls Township, Pennsylvania

(1998)

You cannot plate tin directly on brass, it will cause adhesion problems. You need a nickel or copper layer between the brass and tin. The problems if you skip the underlayer might not be observed immediately, but they can come out with time.

sara michaeli
sara michaeli signature 
Sara Michaeli
chemical process supplier
Tel-Aviv, Israel



(1997)

Several causes possible:

  1. Bad pretreatment; should be visible after the acid dipping in principle with the atomizer-test or the water-break test.
  2. What Tom says about the lead; dipping in HF and using a cyanide copper strike should overcome this problem.
  3. Too much brightener or brightener decomposition products in your electrolyte. If they exceed a few tenths of a percent in the deposit, they will cause "outgassing" during soldering. However, this should be base-material independent. (Can be current density-related).
Harry van der Zanden
Harry van der Zanden
- Budapest, Hungary



This public forum has 60,000 threads. If you have a question in mind which seems off topic to this thread, you might prefer to Search the Site

ADD a Q or A to THIS thread START a NEW THREADView This Week's HOT TOPICS

Disclaimer: It's not possible to diagnose a finishing problem or the hazards of an operation via these pages. All information presented is for general reference and does not represent a professional opinion nor the policy of an author's employer. The internet is largely anonymous & unvetted; some names may be fictitious and some recommendations may be deliberately harmful.

  If you need a product/service, please check these Directories:

JobshopsCapital Equip. & Install'nChemicals & Consumables Consult'g, Train'g, SoftwareEnvironmental ComplianceTesting Svcs. & Devices


©1995-2017 finishing.com     -    Privacy Policy
How Google uses data when you visit this site.