Organic Soil Removal on Copper Panels

I am in need of a fully aqueous, non proprietary, chemical bath (makeup procedure - constituents), capable of removing organic soils, finger oils, light machine oils, etc., from microetch roughened copper clad fiberglass panels (copper surface must pass simple water break test when done). I have a PVC constructed conveyorized spray module in which these panels are to be processed. It has a maximum operating temperature of 130 F. My initial intentions are to use a 5-10% Sodium Hydroxide solution at 120-130 F. I am however unsure if this will suffice. I've considered adding a surfactant such as spiking the caustic with monoethanolamine (good surfactant/cleaner) but am not sure of the computability with PVC at this temp. I'd like to avoid any phosphates.

Are there other simple, safe, biodegradable, surfactants available that I could use?

Langford and Parker, Analysis of Electroplating and Related Solutions [on Amazon, ... on AbeBooks affil links], has a discussion on formulation of cleaners. The pH of alkali is important when formulating a cleaner. There are thousands of surfactants available, some of which decompose a "few days after makeup" (L&P), so analysis and control become problems.