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-----Improving Electroless Nickel on Copper
March 14, 2009
Sir
By optimizing the bath compositions, I am doing Ni-P depositions on pure copper substrate by electroless deposition technique. I have achieved on 1.5 microns thickness per hour. I want to improve up to
25 microns. please guide me in this regard.
Bath composition is
Nickel chloride
Sodium hypophophite
Sodium succinate
Sodium chloride
Water
Operating temperature 80~90 deg C
pH 5.9~3.6
Student - Pakistan
March 15, 2009
Hi, Tauheed. It's not clear if you are doing this in order to get something plated or doing it in order to develop an electroless nickel bath -- but note that proprietary baths are available and that is what most shops use. It's also not clear whether you are trying to obtain a thickness of 25 microns or a plating speed of 25 microns per hour.
Regards,
Ted Mooney, P.E.
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