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"4b. BAKING AND NON-CHEMICAL POST-TREATMENTS [HYDROGEN EMBRITTLEMENT AND DE-EMBRITTLEMENT, ANNEALING, WHISKERS, SOLDERING, REFLOWING]"
• Post Cadmium Plating Tarnish from Baking open Q. - March 2
• Reflow of Tin-Lead Solder open Q. - March 2
• Matte tin turns into bright with reflow open Q. - January 12
• 
Are tiny solid blobs of tin detrimental to PCB?
open Q. - January 4
• Hydrogen Embrittlement and the Lawrence Gauge - November 16
• Chrome plating and Hydrogen Embrittlement Relief - September 9
• How to improve the solderability of tin electroplating? open Q. - July 16