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Flip Chip Package Plating

Q. Hi I'm setting up to plate some flip chip packages. They are approx. 1.5 in square. They have a solder mask coating 1 mil thick and around 9000 pads/openings 4 mils in dia. for a total area of .086 square inches. I need to plate the copper pad up and over the solder mask approx 1.5 mils then do a Nickel and hard gold overcoat. I'm not a chemist so I'm looking for suggestions? I want to use a Hi-Speed copper solution with a nickel barrier coat then a Hard Gold. I'm looking at a hobby plating supplier but not sure if their plating solutions are the right quality. Can anyone point me to a supplier that can supply the chemistry and some advice? I have a small plating system with plastic 1 ltr tanks and a reciprocating arm for agitation of the part during plating.
Thanks

Fran McQuade
Engineer - Hutto, Texas
March 5, 2018

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