Summary for bad solderability of copper zinc plating Discussion
Bad solderability of copper zinc plating is the core issue in this thread. Dudut Yudiantoro of Bekasi, Indonesia asked why a CuZn-plated pin contact would fail solderability testing, with tin not covering the full surface, and whether the part should be stripped before re-plating. In response, a contributor noted that copper-zinc alloys are brass, and brass is generally a poor contact material; electrical contacts are more commonly plated with gold or silver. The answerer said they were puzzled by the use of brass plating on an unknown base material, and suggested that if CuZn plating is required for some reason, the solderability problem may come from an unsuitable flux rather than the plating alone. The practical advice was to consult the solder/flux supplier before assuming the coating must be removed and replaced.
Q. I have material supplied from our supplier. This material use for pin contact of electronic component. Pin contact is plated by CuZn.
But when I solderability test, it fail. The tin can not cover the whole pin contact surface.
The next process, the pin contact shall be tin dip, but the result is not good. The solderability problem.
Question :
1. What is the cause of bad solderability.
2. I want to repair it. Shall I remove the plating before re-plating? How do I remove it?
Dudut Yudiantoro
– Bekasi, Indonesia
September 20, 2012
A. Copper zinc alloys are normally referred to as brass. Brass is a common material for electrical contacts but is usually plated with gold or silver because brass is a very poor contact material. So I am a little puzzled why you are plating your (unknown) base material with brass.
If you have a good reason for the CuZn plating, many soldering problems originate in poor choice of flux. I would suggest that you speak to your solder / flux supplier

Geoff Smith
Hampshire, England
September 21, 2012
Q. Continuing the above problem. The brass 4 – 6 um, covered by nickel 1 – 2 µm or copper 1-2 um. No contamination on the tin plating layer. So the bad solderability is because of not enough nickel thickness? Which is better nickel or copper base?
tq
Dudut Yudiantoro
– Bekasi, Indomesia
October 15, 2012