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-----Adhesion in Palladium to Palladium electroplating
March 26, 2009
We are trying to develop a process where we electroplate palladium patterns over a surface that has palladium and copper on it. We have a bath (ammonia based) that seems to work well, and after lithographically patterning a mold we perform a plasma etch to clean the surface before plating the Palladium into the mold. So far, we have not been having a lot of luck in getting the pattern-plated Palladium to have good, strong adhesion to the surface. Can anyone offer any suggestions on what we can try? We've tried different gases and multiple DOEs in the plasma parameters, basic and acidic Pd strikes, all kinds of cleaning steps to remove all organics, and still we are getting essentially the same range of adhesion strength values. Any help or insight would be greatly appreciated.
-KKIM
R&D manager of technology that uses electroplating - Van Nuys, California
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