Flash Gold Electroforms are more bonded to the mandrel than Nickel Electroforms?

Hi

I am Michael a Chemical Technologist in Electroplating and Electroforming. I am currently on a study about Electroforming Adhesion to the mandrels. The newest idea that we are currently discussing is that;

"why does a flash gold electroform more bonded to the mandrel compared to the nickel electroforms?" Or gold electroforms are thin enough but the underlayers are nickel electroformed items using the same mandrel.

Do you have any idea why is this so?

Thanks,

No connection actually. What can be further studied to is the effect of this post forming to the build up of internal stress. This phenomenon is non-linear. You have to come up with a mathematical model to provide the least internal stress upon combining all interactions in the process more critically on the physicochemical characteristics.