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-----N2 flow rate requirement for Post Plate Bake Oven for Matte-Tin Finish
We are currently doing Post Plate Bake for all of our Matte-Tin plating Products and one of the requirement for our oven is having
200 SCFH (standard cubic feet hour) N2 flowrate.
I would like to know if there is a certain pressure/flowrate that we need to maintain inside the oven, lets say, 2.5 square meters to isolate the moisture for our plated parts?
By the way, we are doing 1 hour annealing at 150 degC.
I'am thinking of reducing the flow rate to minimize cost without affecting the quality.
Plating shop employee - Philippines
January 30, 2008
January 31, 2008
My thoughts from a long time ago.
You initially need about 10 oven volumes turnovers of N2 to reasonably assure that there is little or no O2 in the oven. If moisture is the concern it would be less,UNLESS the parts are wet.
After you have the oven saturated with N2, then all you need is a slight positive pressure in the oven. (IE: very low flow)
- Navarre, Florida
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