Summary for dry film resist stripping Discussion
Dry film resist stripping issue is the main topic here, but the thread contains very little technical detail. Robin John, a process engineer in West Chicago, Illinois, asks for help stripping dry film photoresist from double treated copper surfaces. The only posted reply, from an unnamed responder, says there is not enough information to diagnose the problem and suggests that others may be able to infer more from the limited description. No specific stripping chemistry, process conditions, or corrective action is given, so the discussion does not reach a firm technical conclusion. The practical takeaway is that more process details would be needed before anyone could offer a reliable solution.
Q. Hi,
I’m having problems with stripping dry film photoresist from double treated copper surfaces. Does anyone have any thoughts on this.
Thanks,
Robin John
Process Engineer – West Chicago, Illinois, USA
2007
A. don’t think you’ve given us much to go on, Robin, but we’ll see if someone else can read between the lines.
Ted Mooney, P.E.
Striving to live Aloha
finishing.com – Pine Beach, New Jersey
Need quick confidential answers? $25
Need project assistance? $100/hr.
2007
Q. I just graduated; now I am working at a wafer bumping technology company. Recently, we have a product about copper pillar (plate copper+tin), before plate we PVD a layer of titanium+copper, then coat dryfilm on the surface and expose the plating area by another machine, then we plate copper and tin. After that, we strip the dryfilm with chemical (we buy finished chemical). If there is residue on the wafer surface it will lead to the product low yield. How may I reduce the residue? Can anyone help me? Thanks so much.
Huang Yong
– Shanghai, China
August 15, 2013