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topic 4647

Tin-silver electroplating for leadframe and other applications


(2000)

RFQ: Dear ladies and gentlemen,

I am looking for tin-silver electroplating solutions for leadframe applications. Is there someone who knows who produces it? If you give me your advice, it would be highly appreciated.

Thank you

Chi-Ho Yoon
- Korea
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(2000)

A. Chi-Ho, I am sure you mean tin/silver, it may not exist. You are certain an alloy of tin/lead or pure silver will not meet your specification?

Bill Hemp
tech svc. w/ chemical supplier - Grand Rapids, Michigan


(2000)

A. A recent publication here in the U.S. indicates that a patent application was made for this kind of bath by Dipsol Chemicals Co., Ltd. of Tokyo Japan. The solution is a near neutral pH bath that operates slightly on the acid side.

Hope this is helpful.

ed budman
eb sig
Ed Budman
- Pennsylvania


(2000)

A. Dear mr. yoon,

Are you looking for Sn/Ag alloy plating solution for PPF (Pre-Plated Frame) application or Pb-free application in semiconductor packaging industry ?

Now, in case of Pb-free application, you can put your hands on Sn/Bi, Sn and Sn/Cu alloy solutions in Korea.

Sn/Zn is also available for your research purposes.

Sn/Ag solution can be made but the market volume presently does not permit developing and making it.

What is your target alloy composition of Sn/Ag?

Nelson NK Key
- seoul,korea


(2002)

A. My company offers a tin silver coated product. It is done utilizing the HOT-DIP TINNING process. 2 coating alloys 90%Sn-10%Ag and 95%Sn-5% Ag

Richard Strobel
- Waterbury, Connecticut


July 2014

Hi Richard. Cousin Chi-Ho has requested electroplating solutions rather than hot-dipping solutions. I don't know whether his particular application demands electroplating for any reason, but even if so, other readers may be interested to know that hot-dipping is an alternative. Thanks for introducing the idea.

Regards,

Ted Mooney, finishing.com
Teds signature
Ted Mooney, P.E. RET
finishing.com
Pine Beach, New Jersey


August 25, 2009

adv.
Technic has just introduced a high speed tin/silver plating process for your application. The alloy (90 to 98% tin, balance silver, depending on application) is extremely uniform over a wide variety of plating parameters (current density, temperature, etc.), and the deposit finish is semi bright. Please contact me and I will get you in touch with our Korean division.

George Federman
Plainview, New York




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