| Search our quarter-million Q&As |
Home of the finishing HOTLINE since 1989
-----Au-Sn peel off
2006
We have e-beam deposited Au-Sn (80-20) on the back of the wafer and we are mounting it on an adhesive tape for sawing. But this tape (which is least adhesive available in the market), is peeling off the Au-Sn layer. Is it possible to eliminate this problem by sintering, heating, etc? I appreciate your reply.
Regards,
Deepa
Semiconductor electronics - Westford, Massachusetts
You could use a coating of wax on the backside before using adhesive tape, after dicing and removal of tape you can dissolve the wax.
What is your substrate? Are you depositing Au/Sn on top of any adhesion layer (say Cr/Au)? Au/Sn will not adhere if you deposit directly without a seed layer.
Annealing (@ 200 - 250'C for several hours ) might help reduce the stress in e-beam deposited Au/Sn (280'c is the melting point). Stress can cause the film to peel, it depends on the thickness, your deposition parameters, etc.
Without more information, it is difficult to give the right fix.
Good luck ..
- Austin, Texas
2006
Sorry! Finishing.com is temporarily Read-Only.
Ted Mooney is retiring but I have several offers to take it over.
We're working hard to make sure we find it the best new home.