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Gold Plating Adhesion Problem on Nickel Plated Tungsten Material




2005

We are having some golden plating adhesion problem on a nickel plated surface on Tungsten.

A simple peel test with a normal office used adhesive tape shows that the gold is not adhesing well to the based nickel plating.

This is our specs :

Base material : Tungsten HD-17
Desired surface finshing : [Gold plate MIL-G-45204, Type 1, Grade C, Class 0] over [Electroless Nickel Plate MIL-C-26074 [⇦ this spec on DLA], Class 2, Grade B

I think that tungsten material surface is slightly porous, would this be the root cause of the problem ?

Would anyone be able to advise what to look for in this sort of plating ?

Dylan Lim
Aerospace - Malaysia



Dear Dylan,
Please see to it you do not waste time to plate gold on nickel. It should be a continues process :- only swills (water wash) in between. You may have a pre dip activator before gold under advise from the supplier depending up on what process of gold plating system you use.
Good luck

t k mohan
T.K. Mohan
plating process supplier - Mumbai, India
2005



? Are you using nickel activator and acid gold strike before gold electroplate?

Hamilton Solidum
- Mays Landing, New Jersey, USA
2005



Dear Sir,

We need to gold plate, tungsten wire, my question, can we do gold plating without any toxic material, like cyanide depositing on the plated material.

M.Vijaya Bhaskar
- Bangalore, Karnataka, INDIA
2005




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