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"Ni-NiP vs. pure Ni Plating on Cu Leadframes"



2005

Dear Friends,

We are using Cu-based leadframes for our POWER transistor products. What would be the best plating technique for these Cu leadframes?
1. NiP over Ni over Cu material, or
2. pure Ni plating over Cu

What would be the advantages and disadvantages for each plating option in terms of quality and performance of the plating especially when subjected to high temperatures (150 - 260 deg C) and/or mechanical stress?

Many thanks,

Jun V. Idjao
semiconductors - Laguna, Philippines
^


2005

What are you trying to accomplish with the plating?

Ron Duncan
Ron Duncan [dec]
- LaVergne, Tennessee
It is our sad duty to note Ron's passing on Dec. 15, 2006. A brief obituary opens Episode 13 of our Podcast.

^


2005

Hello Ron,
The plating should provide a good surface (at T-post) for Aluminum wire bonding and a reliable joint (at backside heatsink)once soldered to PCB...

which type (Ni or NiP) will give a better bond with Aluminum wire? and/or

good solder joint when soldered to PCB?

Jun Idjao
semiconductors - Laguna, Philippines
^

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