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-----Package Delamination Effect of Deflash Methods
For continuous improvement purposes, I need to understand the critical differences between electrolytic deflash and chemical deflash (manual type) methods and its respective effect on package delamination. Which method is highly recommended in addressing the package delamination defect?
Rod SanicoCirtek Electronics Corp. - Philippines
2005
Hi Rod,
On the first hand you need to know the material that you are using. ED will affect delamination especially when you have a high current. And 1 thing also is you need to consider the leadframe geometry and its package body size.
- Singapore
2005
Dear All,
I meet delamination issue for SO-8 Package with ED method during plating. But delamination issue is resolved if using chemical deflash method. What's your comments based on theory?
- ShangHai, China
2005
Hi Rod,
I agreed to Irvy's comment. You need to know what type of material your going to use or process. The ED is more on electrolysis of water. If you will browse the website of electrolysis of water you can understand the methods of electrolytic deflash. I hope this can help.
Joy
- Philippines
May 14, 2008
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