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-----Copper Plating Of Unequally Porous Material
Q. I have an unequally porous material. The apparent porosity of the material is about 15-20% and the diameter of the hole is from 3 to 100 micron. May I use periodic pulse reverse (PPR) to introduce copper into the pore? Is there any better method with which I can achieve the aim? The third question is how can I get the details of the references, especially 3 and 5, in the article "A Review Of Copper Plating High Aspect Ratio Plated Through Hole Papers".
Thank you.
Changqingtongstudent - Xian, Shanxi, China
2004
Q. Thanks for your reply. The details are as follow: I have a kind of electric unequal porous material. The open porosity of the material is about 15-20% and the diameter of the hole is from 3 to 100 micron. I want to infiltrate copper into the pore by periodic pulse reverse (PPR). The only thing I have an interest in is the quantity of infiltrated copper rather than the surface condition. I wonder whether this method is feasible. Is there any better method with which I can achieve the aim? The third question is how I can get the details of the references, especially 3 and 5, in your article "A Review Of Copper Plating High Aspect Ratio Plated Through Hole Papers".
Thank you.
Changqintongstudent - Xian, Shanxi, China
2004
A. PC FAB magazine is now part of PRINTED CIRCUIT DESIGN & MANUFACTURE, published by UP MEDIA GROUP in Atlanta, Georgia, USA.
Tom Gallant- Long Beach, California, USA
2004
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