Summary for expired lead frame Discussion
Expired lead frame is the key concern in this thread, but the only answer given does not describe plating defects or process outcomes. The original poster asked whether using expired lead frames in solder plating and tin plating could create quality problems such as metallic debris, solder burrs, or solder flakes in IC assembly. A later follow-up asked more generally about the effect of expired lead frames in assembled units. The response, from "cousins," says these are not proper questions to ask a third party because only the design authority that set the requirement can know the full consequences of ignoring it. In other words, the thread does not confirm specific plating defects; it emphasizes that the risk and acceptability depend on the governing design/specification authority.
Q. I am solder plating engineer in IC manufacturing assembly. I want to know the effects of using expired lead frame in solder plating and tin plating process. Does using expired lead frames cause potential quality problems like metallic debris or solder burr or solder flakes? Maybe some of you have experiences about it?
Bintan
IC Assembly – Lobam, Riau Island, Indonesia
2003
This is a meeting place for camaraderie & sharing, not a free consultancy. So some readers don’t engage with anonymous posters.
Q. What is the effect of expired leadframe if we used it with the assembled unit.
Lorena landero
– Laguna Philippine
January 31, 2024
A. Hi cousins.
Unfortunately, these are not proper questions to ask a 3rd party. The design authority who imposed the requirement are the only folks who know the full implications of not abiding to it.
Luck & Regards,
Ted Mooney, P.E. RET
Striving to live Aloha
finishing.com – Pine Beach, New Jersey
Need quick confidential answers? $25
Need project assistance? $100/hr.