Search our quarter-million Q&As

Home of the finishing HOTLINE since 1989

-----

Copper electroplating on copper

Hi,

I am trying to electroplate Copper onto a copper coated substrate to get a thick layer of Copper on my substrate. After I plate Copper, the moment I take out the sample from the electrolytic solution, the plated Copper along with already present Copper on the substrate peels off. I am not sure of this situation. Could you please suggest me the reason.

Thanks

Sud
- Raleigh, North Carolina
2003

---

Your question is broad. We need to know what solution you are using for copper plating, what the substrate is, how that first layer which is pulling off got on the substrate in the first place, etc. But it is reasonably clear that the initial copper layer is defective.

Ted Mooney, P.E.
Striving to live Aloha
finishing.com - Pine Beach, New Jersey
Need quick confidential answers? $25
Need project assistance? $100/hr.
2003

---

Hi, Sud!
Mr. Ted is right. It would really help if you describe to us your plating setup and the material you want plated. But for starter, and if you can, you may rub (with emery paper) off a small amount from the original plated copper to expose a new copper layer. Then try to plate again.

H. Dacillo
- Manila, Philippines
2003

Sorry! Finishing.com is temporarily Read-Only.
Ted Mooney is retiring but I have several offers to take it over.
We're working hard to make sure we find it the best new home.

---

---