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Under coating clarification

2003

Dear Sir,

We do the connectors for Telecom application. At present we are doing Nickel as a under coat & silver as a top coat with minimum five microns for connector terminals. We would like to know, for under coat application, which one is superior ( nickel OR Copper ) in terms of product reliability & other technical issues? Could you please suggest some reference books for this subjects. Also what is the minimum thickness we have to maintain in both cases?

With Regards,

Mohan. G.
communications company - Bangalore, Karnataka, India

Hi, Mohan. Copper is no good. The nickel plating preserves solderability and acts as a barrier against diffusion. We have an on-line article here by Paul Stransky which may offer some help on your barrier layer plating questions. Good luck.

Ted Mooney, P.E.
Striving to live Aloha
finishing.com - Pine Beach, New Jersey

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