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topic 2223

Cobalt in gold deposits.


(1998)

Hi,

I have analysed a connector having a gold plating over Cu with EDX (Energy dispersive x-ray analysis). I have found Co (Cobalt) present in the gold layer which first seemed natural since Co is used as an additive to provide hardness. However, the concentration of Co is very high close to the interface Cu/Au and it then decreases as one moves into the Au-layer.

Thus my questions:

- Is Cobalt used instead of Ni (Since they are chemically alike) as diffusion barrier to avoid electromigration?

Or:

- Is it likely that Co is enriched during the initial stages of electrodeposition of Au?

Or are both alternatives plausible?

I will probably go to more sophisticated analysis methods like SIMS but since there is an enormous amount of knowledge on this tremendous web-site maybe I can spare some time...

Thank you in advance

Hannes Medelius
- Stockholm, Sweden



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