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"Electroless copper plating adhesion"



1998

I need help on a problem-
I am developing an epoxy based material that the customer wants to copper plate with electroless copper. The dilemma is in how to improve adhesion of the e-copper to the epoxy material.

Please send suggestions for improving electroless copper adhesion to epoxy to:

David Zoba
electronic materials
^


1998

David,

A couple of things come to mind with epoxy that could give you some micro-roughness. Plasma treatment is one, the other is chemical attack, there are several acids that would do this.

What kind of peel strengths are you getting now ?

Paul Stransky
- Putnam, Connecticut
^


2000

Dear Sir

I am interested in your an epoxy based material on electroless copper plating technology. please send me information. Thank you Sung-Ryoung LIM

Sung-Ryoung Lim
kyunggi-do, Korea
^


2000

How do you test the peel strength? I'm also involved in electroless (nickel) on an epoxy/carbon fiber substrate. My parts are cylindrical.

Thanks,

Alan Kirkpatrick
- Shelburne, Vermont
^


June 8, 2009

David,

It depends on the composition of your epoxy. More detailed on the chemical nature of the curing agent. This curing agent can positively influence the copper adhesion. Other possibilities are surface roughening via plasma or etching techniques or surface modification via plasma or wet chemical reactions.

David Schaubroeck
- Ghent, Belgium
^

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