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topic 1683

Acid Copper Plating Bath Organic Additive Structures


(1998)

Dionex currently has a great deal of background in the HPLC analysis of acid copper plating baths. Of most interest to our customers are the determination and quantifying of the brighteners, carriers and levelers. Most of our work is empirical, because the structures of these additives are often covered by patents or confidentiality agreements.

Is there any reference that gives a discussion on the structure and functional groups of these compounds? It would make the methods development for these analysis a great deal easier.

Thanks in advance.

Paul Newton
- Sunnyvale, California



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