I am working with characterizing the mechanical properties of LIGA Ni spring systems. I have a batch of samples on a silicon wafer under a 3micron layer of titanium. I know that HF is used to etch titanium but I wanted to know if someone knows the exact concentration of the HF and the time it takes to etch this 3 micron layer. Also if heating is required.
Carolina Elmufdi - Baltimore, Maryland, USA ^
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