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topic 10531

Electroless gold deposition


Dear Sir,

We are trying to deposit electroless gold on Si. The silicon substrate is etched with few micron in size and about 15 micron in depth small holes. The gold layer is expected to coat through inside the holes to make electrical contact. We have tried electroless Ni, however, the bubbles stopped the plating in the holes. Is any electroless gold plating processes suitable for this application?

Susan Hua
- Buffalo, New York


Metal vapor deposition guys, this one's for you I guess.

Guillermo Marrufo
Monterrey, NL, Mexico


I think that:

- applying tin chloride to Si as a catalyst

- Replace Tin to Gold by immersion sodium gold sulfide solution.

Nelson NK Key
- Seoul, Korea

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