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topic 653

Low weight alternatives to circuit board finishing


(1996)

We are bonding circuit boards to beryllium-aluminum alloy frames with silver filled conductive epoxy adhesive. Beryllium-aluminum is used as the frame material to reduce weight (this is for an aerospace application).

Nickel coating of the frames to prevent corrosion between the frames and the silver filling is adds significant weight. The galvanic couple between aluminum and nickel causes the need for nickel coating to be for the entire system once one part of the system is nickel coated.

Any suggestions for alternate lighter weight means of protecting the interface is greatly appreciated.

Steven Axelband
- avionics


(1999)

It sounds as if you need an electrically conductive epoxy primer to prime the components prior to bonding. I need the same thing! Hopefully we will see a response.

James H. Pfeifer



(2000)

RE: "Any suggestions for alternate lighter weight means of protecting the interface is greatly appreciated", You may want to look at silicon polymer materials, or possibly manganese, copper, zinc, bismuth, gold. The silicon polymer material can be somehow infused into the aluminum-beryllium alloy. Chuck

Chuck Shaw
- Ferndale, Washington



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