Converting to Pd/Ni Preplated Leadframes
I work for a semiconductor manufacturer that is looking to convert to Pd/Ni pre-plated leadframes. Would appreciate any helpful hints/tips for processing. For instance:
1. Any tips on die attach, wirebonding or molding parameters?
2. How does one go about mold deflash? Classical deflash for semiconductor plastic packages includes: chemical, slurry, dry media, electrochem but all of these are too harsh for relatively thin Ni/Pd plating.
3. Any hints on trimming/forming? Does thin plating flake off or scratch easily?
Dennis, the first question is Whose Pd/Ni are you using? (buying?) The Three basic types have different degrees of mechanical integrity and chemical resistance. The TI 2 step? The TI 4 step? the Lea Ronal 3 step, or the AT&T 3 step? As you may know already, none of these solder very well after deflash, so TI suggests post-plating with Sn/Pb (the "Preferred Embodiment"). Best bet is to contact your leadframe supplier, find out the process vendor, and request deflash process alternatives. In my experience, the slurries work pretty well; you just have to adjust parameters for your particular flash conditions. Check out the other Pd/Ni inquiry on this web page [letter 478] for additional Info.
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