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The below was a proposed technical program for an event and may not represent the final program, nor the contents of the Conference Proceedings for that event. If you are seeking a particular paper, contact the event's sponsor to make sure it is an actual part of their Conference Proceedings before ordering them.

The American Electroplaters and Surface Finishers Society, Inc.

AESF & NiDI
Electroforming Course & Symposium

March 27-29, 1996
Imperial Palace Hotel Las Vegas

Wednesday, March 27

Course Organizer & Chairperson: Ron Parkinson, Nickel Development Institute, Toronto, Ontario, Canada

Session 1 Basic Electroforming Technology

1 p.m. Welcome & Opening Remarks
Ron Parkinson, Nickel Development Institute, Toronto, Ontario, Canada

1:10 p.m. Electroforming Principles
Dr. George DiBari, Inco, Saddle Brook, NJ

1:30 p.m. Electroforming Solutions: Compositions, Operation & Control
Dr. Donald Snyder, Atotech USA, Cleveland, OH

2:30 p.m. How to Measure Deposit Properties
Dr. George DiBari, Inco, Saddle Brook, NJ

3 p.m. Mechanical Properties of Electroformed Metals
Jack Dini, Lawrence Livermore National Laboratories, Livermore, CA

Thursday, March 28
Session 2 Electroforming Applications

8:30 a.m. The Record Industry & High Definition Electroforming
Speaker to be announced

9:15 a.m. Screen & Mesh Products
Ron Parkinson, Nickel Development Institute, Toronto, Ontario, Canada

10:15 a.m. Electroformed Molds
Dr. George DiBari, Inco, Saddle Brook, NJ

11:10 a.m. Ornamental Applications: Jewelry & Other Decorative Articles
Alan Day, MIMF, Enthone-OMI, Warren, MI

2 p.m. Aircraft & Aerospace Components
Glenn Malone, ENI, Huntsville, AL

3 p.m. Foil Production, Metal Foams, Seamless Belts, Currency & Other End-Uses
Ron Parkinson, Nickel Development Institute, Toronto, Ontario, Canada

4 p.m. Panel Discussion


Friday, March 29

Symposium Organizer & Chairperson: Dr. George DiBari, Inco, Saddle Brook, NJ

8:30 a.m. Keynote Speaker
Electroforming: Fabrication, Flexibility & Fun
Dr. Michael Sole, Huddy (Pty.) Ltd., Johannesburg, Republic of South Africa

9:10 a.m. Electroforming of Electronic Devices
Dr. Lubomyr Romankiw, T.J. Watson Research Center of IBM, Yorktown Heights, NY

10:10 a.m. Guide to Understanding, Measuring & Controlling Stress in Electroformed Metals
Berl Stein, Fresnel Optics, Rochester, NY

10:40 a.m. Electroforming Female Vacuum Forming Tools: Porous Molds
Morris Mengle, FET Engineering, Bardstown, KY

11:10 a.m. Precious Metal Electroforming: Gold, Gold Alloys, Silver & Platinum
Alan Day, MIMF, Enthone-OMI, Warren, MI

1:30 p.m. Electroforming Cell Design Tool Development (A Videotaped Presentation of Computer-aided Design of Electroforming Cells)
Gary Giles, Oak Ridge National Laboratory, Oak Ridge, TN

2 p.m. LIGA Processing: New Dimensions for Electroforming
W.D. Bonivert & J.T. Hachman, Sandia National Laboratory, Livermore, CA

2:30 p.m. Aids for Electroforming Complex Shapes Uniformly & Rapidly
Glenn Malone, ENI, Huntsville, AL

3 p.m. Question-and-Answer Session