621 NE Harrison St.
Poulsbo, Washington 98370-8453
I have probably already seen your problem.
Extensive experience in:
70+ papers and numerous patents.
Contributions to many of the industry's principal references,
Founder and President of Electrochemical
Laboratories. 13 years servicing the plating industry. Proven
accomplishments in process chemical research and development,
including 23 years as Vice President of R&D of Allied-Kelite, a
supplier to the plating industry. Extensive marketing and business
DONALD (DON) BAUDRAND
ELECTROLESS PLATING. Extensive experience in research and
development of electroless nickel-plating products and processes.
Electroless nickel plating on thin-film memory discs, all aspects of
preparation and plating, metallized ceramics, printed circuits,
hardware, automotive, electroless forming and electronics. Experience
in electroless copper, gold and palladium. Formulating electroless
nickel phosphorus and alloys, nickel- boron and alloys of various
metals and particulate materials. Familiar with equipment, process
design, formulation, maintenance and troubleshooting electroless,
electroplating, conversion coatings and anodizing processes.
ELECTRODEPOSITION; ELECTROPLATING; ELECTROLESS PLATING.
Knowledgeable of a whole range of electroplating materials and
processes, author of many articles and book chapters. Worked with
plating of gold, silver, nickel (including sulfamate nickel, nickel
sulfate (Watts) Woods and Sulfamate nickel strikes, bright, leveling
nickel and special nickel processes. Familiar with Copper plating
from cyanide, acid and pyrophosphate solutions, along with sulfonic,
sulfuric and fluoboric acid processes for copper, tin lead, and
alloys of various metals. Experience in cadmium, zinc, brass and
bronze plating. Can answer questions on cleaning, activating and
surface preparation and conditioning processes.
PLASTICS PLATING. Knowledgeable in the preparatory steps,
including cleaning, etching, conditioning and sensitizing and
catalysts, for electroless plating of nickel and copper on plastic
substrates and electroplating of plastics. Co-authored a book on
plating of ABS plastic.
PRINTED-WIRING (Circuit) BOARD PROCESSES. Experience
includes preparation for and plating of printed-wiring boards,
including through hole and surface mount boards as well as flex,
multi layer and molded circuits. Designed processes and equipment for
the manufacture of printed circuit boards of all types. Analyzed
process and plating chemicals for maintenance of the solutions. Did
research and supervised research and development of process chemicals
and plating solutions for printed circuits, including multi-layered
bonding chemicals. As a consultant, advised printed circuit
manufacturers as to type of preparation chemicals, plating chemicals,
equipment and process sequence design. Wrote chapter 9 of Electronic
Materials and Processes Handbook Published by McGraw Hill.
DIRECT ELECTROPLATING. Experienced in the use of process
cycles and chemistry for direct plating of through-hole printed
circuits, including both theory and practice of direct
MCM-C and MCM-L (MULTICHP MODULES). Experience in processes
for plating MCMÄôs, including patents in this field.
CLEANING OF MATERIALS FOR PLATING. Experience Including
formulation, cleaning of leaded alloys, steel alloys, copper alloys,
acid, alkaline and solvent processes.
ELECTROGALVANIZING AND OTHER CONTINUOUS STRIP STEEL
PLATING. Involvement in continuous plating as practiced in steel
mils for zinc, nickel, copper brass and bronze.
EDUCATION: B.S. Chemistry, Whittier College 1950. Graduate
studies in chemical engineering nuclear physics and business
management, UC Berkeley.
Don was founder and President of Electrochemical Laboratories, Los
Vice President of Research and Development for Allied Kelite, Div.,
Vice President and Business manager for Allied Kelite.
Don has numerous patents in electroless plating and
microelectronics, and has authored over 70 papers. He has contributed
to the ASM Metals Handbook, the McGraw-Hill Electronic Materials and
Processes Handbook, chapter 9, and "Electroless Plating Fundamentals
& Applications", chapter 9. Don has co-authored Plating of ABS
Plastics, Robert Draper Ltd, AES 1960 Plating Handbook, and others.
Retired, August 1994, after 46 years of plating experience.
(Member of AESF for 44 years) Presently Consultant in electro and
electroless plating processes. Don has extensive experience in
research and development of electroless nickel-plating products and
processes. Included are products for memory discs, metallized
ceramics, microelectronics, printed circuits, hardware, automotive,
aerospace, engineering and other applications Don has knowledge in
the whole range of electroplating materials and processes. He has
worked with gold, silver, nickel, including sulfamate nickel, nickel
sulfate, woods and sulfamate nickel strikes, bright, leveling nickel
plating and other special nickel processes. Copper plating from
cyanide, acid pyrophosphate, sulfonic acid, fluoborate and others,
tin and tin-lead, tin bismuth, and other tin alloys, cadmium, zinc,
brass and bronze are included in his experience. Experience in
corrosion protection, chromate conversion coatings, Anodizing of
Aluminum alloys, preparation of aluminum for painting and adhesive
bonding are included. Plating onto "difficult to plate" materials has
been a specialty, along with electroless nickel. Preparation cycles,
direct plating, electrogalvanizing and continuous strip plating are
also included in his experience. Don has experience in expert witness
testimony, deposition and reports.
SUMMARY OF ACCOMPLISHMENTS
Managed two successful corporations as president and CEO for one,
and CFO for the other. Managed Research and Development programs with
total responsibility for innovation, screening, field testing, and
market introduction or more than 100 products. Managed sales and
marketing programs. Developed computer memory disc, hybrid
microelectronics for plated components and other markets. Bottom line
Developed strategy and programs that produced successful new
products. Introduced, supported and carried out strategic planning
programs for the corporation. Developed a format of matrix milestone
and graphs to evaluate the research programs at all stages. Developed
methods to evaluate the economic benefit of research programs.
Identified and initiated entrepreneurial business ventures in
Successfully introduced more than 100 new or modified products.
Brought into the organization, from Electrochemical Laboratories, new
products such as electroless nickel-plating technology patents, etc.,
which enabled the company to establish world leadership in terms of
technology and sales dollars. Introduced electronics technology to
the company via specialty chemical processes sold under the trade
name "NIKLAD"*. Helped develop technical leadership and market
in numerous other specialties such as "IRIDITE"* chromate conversion
protective coatings, "ISOBR1TE"* plating processes and
"BARRETT"* sulfamate nickel-plating processes.
Succeeded in introducing to the marketplace an advanced method of
producing "thin film memory discs" for "hard drives" for the computer
industry. Major producers use the process in production. Products for
making hybrid microelectronic circuits and packages, including
multilayer ceramic circuits (patented) was successfully introduced.
Led a successful marketing program for the company. Conducted
technical and sales training for 17 sales districts in the U. S., and
provided technology transfer and sales marketing programs for over
* Trademarks of MacDermid, Inc. Waterbury CT
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