The home page of the finishing industry ®
Contributed by Paul Stransky, Paul Stransky Associates
Title Page Issue Infrared Solder Fusing, by Carson Richert 23 Oct. 8O Selectlve Solder Coating: Solving Your Customer's Problems, by Charles R. Smith 10 Aug. 81 Troubleshootng the IR Fusing Process, by Mike Palazzola 20 Aug. 81 The Application ofHot-Alr Leveling to Printed Wiring Board Fabrication, by Paul J. Bud 33 Aug. 8l The Mechanics oflR Fusing: Maintenance and Components, by Carson Richert 42 Aug. 81 Vapor Phase for the fluxless fusion of tin/lead electroplated PCBs, by Harold Hyman 41 Sep. 81 SMOBC wlth "Electroless" Tin, by Jack D. Fellman l6 Oct. 82 A User's Viewpoint of Vapor-hase Fusing, by Russ B. Foley 18 Oct. 82 Quallty Aspects of Hot-Air Solder Leveling, by Greg C. Masciana 29 Oct. 83 SMOBC ln '83, by Jack Fellman 36 Oct. 83 Hot-Air Leveling - The Process and the Product, by Odilon Cardenas 44 Oct. 83 A Hlstory ofSolder Levellrrg, by Keith Oxford l24 Jul. 84 Hot-Alr Leveling, by Albert Fishfeld 49 Oct. 84 Fluxless Fusion Process for PCBs, by Carol M. Moss 178 Feb. 85 Automation in Hot-Air Leveling, by D. Hatfield 18 Oct. 85 Fusing Flux Residues, by Tom Steinhoff l52 Nov. 85 The Relationsbip ofCleaning Copper to Solder Leveling, by Theodore Sulzberg, Fred Shubert, and W. Darlene Brewster 118 Oct. 86 Hot-Air Leveling: Today's Requirements, Tomorrow's Potential, by Andrew A. Miller 81 Dec. 86 Solder Leveling of Surface Mount Boards by Nimal Liyanage 6O Oct. 87 Hot-Air Solder Leveling by Michael Cleppin 54 Dec. 87 The State of Solder Leveling 72 Dec. 88 A Fresh Approach to Process Characterization, by Mark Williamson and Mike Moore, 72 FEB. 92 HAL Specifications and Process Controls, by Sherry Goodell, 42 MAR. 92 Automated HotAir leveling, by Mark Simmons 30 Jul. 94
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