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Solder Leveling

Contributed by Paul Stransky, Paul Stransky Associates

Some references

The IPC has a committee on soldering, and may also have published info on future trends, etc., re. solder leveling.

Solder Handbook, Howard Manko

Printed Circuit Handbook, Clyde Coombs, McGraw Hill

Printed Circuit Fabrication Magazine 1980 - 1994

Title                                       Page      Issue                                                                         
 
Infrared Solder Fusing, by Carson Richert    23        Oct. 8O
 
Selectlve Solder Coating: Solving Your
Customer's Problems, by Charles R. Smith     10        Aug. 81
 
Troubleshootng the IR Fusing Process,
by Mike Palazzola                            20        Aug. 81
 
The Application ofHot-Alr Leveling to
Printed Wiring Board Fabrication, by Paul
J. Bud                                       33        Aug. 8l
 
The Mechanics oflR Fusing: Maintenance
and Components, by Carson Richert            42        Aug. 81
 
Vapor Phase for the fluxless fusion of
tin/lead electroplated PCBs, by Harold
Hyman                                        41        Sep. 81
 
SMOBC wlth "Electroless" Tin, by Jack D.
Fellman                                      l6        Oct. 82
 
A User's Viewpoint of Vapor-hase Fusing,
by Russ B. Foley                             18        Oct. 82
 
Quallty Aspects of Hot-Air Solder Leveling,
by Greg C. Masciana                          29        Oct. 83
 
SMOBC ln '83, by Jack Fellman                36        Oct. 83
 
Hot-Air Leveling - The Process and the
Product, by Odilon Cardenas                  44        Oct. 83
 
A Hlstory ofSolder Levellrrg, by Keith
Oxford                                       l24       Jul. 84
 
Hot-Alr Leveling, by Albert Fishfeld         49        Oct. 84
 
Fluxless Fusion Process for PCBs, by Carol
M. Moss                                      178       Feb. 85
 
Automation in Hot-Air Leveling,
by D. Hatfield                               18        Oct. 85
 
Fusing Flux Residues, by Tom Steinhoff       l52       Nov. 85
 
The Relationsbip ofCleaning Copper to    
Solder Leveling, by Theodore Sulzberg, Fred   
Shubert, and W. Darlene Brewster             118       Oct. 86
                                            
Hot-Air Leveling: Today's Requirements,     
Tomorrow's Potential, by Andrew A. Miller    81        Dec. 86
 
Solder Leveling of Surface Mount Boards      
by Nimal Liyanage                            6O        Oct. 87
 
Hot-Air Solder Leveling by Michael Cleppin   54        Dec. 87
 
The State of Solder Leveling                 72        Dec. 88
 
A Fresh Approach to Process Characterization,
by Mark Williamson and Mike Moore,           72        FEB. 92
 
HAL Specifications and Process Controls,
by Sherry Goodell,                           42        MAR. 92
 
Automated HotAir leveling, by Mark Simmons   30        Jul. 94                 
 

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