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Session Organizer & Chairman: Harry J. Litsch, CFE-SE,
H.J. Litsch Consultants, Inc., Bethlehem, PA
1 p.m._The Reduction of Drag-out in Barrel & Rack
Plating Plants in Combination with a New Improved Drying
Technology
Andreas Mobius, LPW Anlagen GmbH, Neuss,
Germany
This paper will describe new developments that reduce the drag-out
field of barrel plating. Practical results will be reported with new
barrels, barrel blow-out and rinse systems. A new pulse-blow-dryer
will be discussed that works with reduced temperatures, has a short
drying time and creates a stainless surface.
1:30 p.m._Improvement of Tribiological Properties Through
Nitrocarburizing
Georg Wahl, Durkerrit GmbH Thermotechnik, Hanau,
Germany & Sharon Alwart, Degussa Corp., Ridgefield Park,
NJ
Nitrocarburizing has long been successful in improving the surface
properties of parts. A new process has been developed to allow
nitrocarburizing at a temperature low enough to treat the necessary
metal parts. This paper will discuss the influence of the treating
parameter on the tribological properties and fields of application,
and it will give comparisons of cost.
2 p.m._Software Applications in Surface Finishing Education
& Technology
T. Shiraki, K. Kaminaga & T. Sato, Shibaura
Technical University, Tokyo, Japan
Popular high-performance and easily available software in mathematics
and analog circuit simulation will be applied in surface finishing
education and technology. Mathematics software can be used for
physiochemical calculations in surface finishing and wastewater
treatment. Software for analog circuit simulation can be used for
simulating DC or pulse electroplating and AC coloring of anodized
aluminum.
2:30 p.m._Durability of Warning Labels & Plates
A. Ohtsuka, K. Kaminaga & T. Sato, Shibaura
Technical University, Shibaura, Minato-ku, Japan
The enactment of the Product Liability Law in Japan has made it
extremely important that warning labels and plates be durable. This,
in turn, has prompted the need for novel developments in surface
finishing technology. A report will be presented analyzing the
durability of current labels and plates, and it will introduce some
new methods for their manufacture.
3 p.m._Keys to Improved Communication Skills for
finishers
Julie Mitchell, Mitchell Communications, Cleveland,
OH
Session Organizer & Chairman: Joelie Hill, Scientific
Control Laboratories, Inc., Chicago, IL
1 p.m._Determination of Brightener Concentration in
Non-cyanide Alkaline Zinc Plating Bath by Cyclic Voltammetric
Srtipping Method
S. Rajendran, Dr. S. Bharathi, V.N. Loganathan, C.
Krishna & K.R. Anandakumaran-Nair, Lucas-TVS, Madras,
India
A new cyclic voltammetric stripping (CVS) method for analyzing the
proprietary brightener concentration in a non-cyanide alkaline zinc
plating bath will be discussed. Using this CVS technique, the effect
of primary additives and brighteners, singly and in combination, on
zinc plating rate was extensively studied. From the calibration
curve, it is possible to quantitatively estimate the brightener
concentration within 1% error. This method has been successfully
applied to control the brightener concentration in non-cyanide zinc
plating production baths.
1:30 p.m._Simultaneous Multi-Metal Analysis
E.C. Stortz, C.D. Zhou, J.D. Burghard, Z.H. Jin, E.J.
Taylor & R.P. Renz, Faraday Technology, Inc., Dayton,
OH
An electrochemical transducer based on anodic stripping voltammetry
(ASV) and high surface area microelectrode technologies has been
developed. This transducer will be used in the plating industry for
process control and compliance verification. Specifically, an
accurate, rapid, and simultaneous multi-metal analysis methodology
for low metal concentration analysis has been created. Clarifier
water, copper rinse water, and lead/tin rinse water from a commercial
printed wiring board facility was analyzed to measure trace copper
and lead concentration with the developed metal monitor. The results
are comparable with the results from atomic adsorption
spectrometry.
2 p.m._Metallization of Polypyrrole Part III:
Electrodeposition of Silver
Maria Hepel & Cynthia Rice, SUNY College, Potsdam,
NY
Conductivity of thin polypyrrole films can be substantially
increased by incorporating silver particles into the polypyrrole
matrix or by plating polypyrrole with a thin film of silver. In this
paper, several factors that influence the micromorphology of silver
deposits such as the pH, the deposition potential, additives [e.g.,
sodium potassium tartrate (SPT)], and the composition of substrate
electrode will be investigated. Morphology of silver electrodeposit
will be examined using scanning electron microscopy, and distribution
of silver particles as in the polymer matrix will be confirmed by
using energy dispersive spectroscopy (EDS) analysis.
2:30 p.m._Submersible Sensor Probes for In Situ Monitoring of
Bath Composition in Metal Plating
Tadeusz Hepel, Miroslaw Hepel & Joseph Wiejak,
ELCHEMA, Potsdam, NY
This paper will report on the development of new sensors that
can be applied to in situ monitoring and control for industrial
plating baths, emphasising the copper and chromium plating processes.
A fully automatic bath composition control system has been developed
and tested in an industrial plating plant. Based on submersible
sensor probes, the system can operate in strongly corrosive
environments, and its software creates a comprehensive database and
reports the results. New sensors for laboratory and field testing of
bath composition will also be discussed.
3 p.m._Control of Plating Solutions in the Automotive
Industry by Stripping Voltammetry
P. Bratin, G. Chalyt, M. Pavlov, E. Izro & R.
Guzman, ECI
Technology, Rutherford, NJ & G. Boiksa, McGean-Rohco, Inc.,
Cleveland, OH
Increasing requirements on quality, cost, and environmental issues in
the automotive industry call for tighter control of electroplating
solutions and a narrowing of the operation windows. This creates a
demand for high-accuracy analytical tools capable of multi-component
analysis of plating solutions. The CVS (cyclic voltammetry stripping
) method has become a leading technique for control of organic
additives in copper, tin, and tin/lead electroplating solutions for
the electronics industry. This presentation will discuss the
capability of the CVS technique for analysis of zinc, and the nickel
plating solutions used in the automotive industry.
3:30 p.m._Executive Summary
Mark Boivin, Enthone-OMI
Process control in the specialty chemical industry is
comprised of many elements. Enthone-OMI has gained ISO 9000
certification in all of its major manufacturing sites worldwide.
These systems control the activities from the supplier of raw
materials through manufacturing personnel to quality assurance. A
case study on the manufacture of an electroless nickel component will
demonstrate the extent of level of control.
4 p.m._X-Ray Fluorescence_New Key to Highly Accurate
Non-Destructive Coating Thickness Measurements for Industry
Dr. Nicholas Yanaki, CMI International, Elk Grove
Village, IL
A treatise on X-ray fluorescence technology and its importance
to the surface finishing and printed circuit board manufacturing
industries will be presented. Details will be given about X-ray
generation, shell lines and energy levels, characteristics of X-ray
emission, X-ray tube operation, a unique tube cooling method,
microfocus filament advantage, programmable collimator action,
optimum target material, target surface erosion, advantages of
tungsten vs. molybdenum target, and key advantages of beryllium vs.
glass windows.
4:30 p.m._Distribution of Cr(VI) in Solutions of Acids
Prof. R. Sarmaitis, V. Dikinis, V. Rezaite & V.
Stasiukaitis, Institute of Chemistry, Vilnius, Lithuania
The experimental dependence of the apparent constant of formation of
polychromium particles K3 on pH was determined by the static ion
chromatography method. The equilibrium forms of Cr(VI) particles were
estimated in solutions of acids. the effect of the presence of
substituted chromates on distribution of equilibrium forms of chromic
acid was evaluated. The change of acidic properties of Cr(VI)
solutions was calculated with introductions of anions of various
acids into their composition.
Session Organizer & Chairman: Tim Denhof, Scientific
Control Laboratories, Inc., Chicago, IL
1 p.m._Structure & Morphology of Three Types of
Zinc Deposits from Cyanide, Zincate & Chloride Bath
S. Rajendran, V.N. Loganathan, S. Bharathi, C. Krishna
& K.R. Anandakumaran-Nair, Lucas-TVS, Madras, India
The deposit microstructure and surface morphology of three zinc
plating systems will be compared by conventional microscopy and
scanning electron microscopy. Results show that the possible
difference in the surface composition and morphology accounts for the
lower corrosion resistance of chloride zinc. Also, the different
composition of zinc deposits from these electrolytes result in the
variations in thickness measurements by different techniques. The
effect of brightener on the composition of the zinc depost will be
explained.
1:30 p.m._On the Relationship Between Surface Morphology
& the Kinetic Factors of Conversion Coating Formation
Dr. Mois Aroyo & Nicola Tzonev, Technical
University, Sofia, Bulgaria
Because of their crystal structure and surface morphology, conversion
coatings can serve as bases for paints, lacquers and plastics.
Roughness measurement tests have been performed to reveal the
relationship between the surface morphology of conversion coatings
and the activation and concentration polarization of the cathodic
reaction. The activation polarization is charged by applying low
voltage sinusoidal polarization with a frequency between 50Hz to
10kHz. The limiting diffusion cathodic current is controlled by
adding an agent with high hydronamic activity. This makes it possible
to find such forming conditions that provide the best adhesive
performance of conversion coatings.
2 p.m._Pre-pickling Effect on the Surface Appearance of
Chromated Films
Yon-Kyun Song & Hyung-Joon Kim, Pohang Iron &
Steel Co., Kyungbuk, Korea
In this study, the pre-pickling effect on the surface appearance of
chromated film was identified by using SEM, SAM, XPS and 3-D surface
roughness meters. The whiteness of Zn-electroplated and chromated
sheets depends mainly on the chemical state of the Zn surface that
has been electroplated. Zn oxide states such as ZnO or ZnO1-x make
the surface darker, while a pure Zn state makes the surface brighter
with pre-pickling. It will be argued that pre-pickling removes zinc
oxide and makes for a pure Zn state.
2:30 p.m._Effects of Plating Variables on Thickness
Distribution in Alkaline Non-Cyanide Zinc: A Designed Experiment
John Commander & Mark Chasse, Enthone-OMI, New
Haven, CT
Ideally, bath parameters are optimized so that the best ratio of
deposit thickness (1:1) of recesses to flat areas is achieved. In
this paper, four variables that are expected to affect plating
efficiency and distribution will be examined. These variables are
zinc metal concentration, caustic soda concentration, temperature,
and current density. A fractional factorial designed experiment will
be used to determine the effects of the variables with three
different commercially available processes.
3 p.m._Study of the Potassium Hydroxide Alkaline Non-cyanide
Bath
Vijay Kansupada, Novamax Technologies, Inc., Atlanta,
GA
This paper will describe a study of potassium hydroxide-based
zinc electroplating bath from the standpoint of the appearance of the
deposit; distribution; efficiency; and a comparison to conventional
sodium hydroxide baths.
3:30 p.m._Morphological & Impedance Analysis of Zinc
Electrocrystallization in a Chloride Solution
Jeong-Real Park & H.T. Kim, Pohang Iron and Steel
Company, Chunnam, Korea
Impedance spectroscopic measurements of the electrogalvanizing on
carbon steel in a quiescent zinc chloride solution as a function of
the pH, the additive, and the current density were performed. SEM
microscopic observations of the galvanized surface were carried out
and correlated in order to better understand the electrogalvanizing
mechanism. By the additive, low current density and high pH, the
characteristic impedance of the reaction will reveal gradual
development of inductive loops on a complex plane plot, because it is
related to the nucleation-controlled growth of the zinc crystals.
4 p.m._A New Process for Plating Zincate Electrolytes
Chris Mayhew, W. Canning, Inc., Palatine,
IL
A new process for electroplating zinc from a zincate-type electrolyte
will be described. The outstanding features are an almost constant
thickness over complex shapes combined with a high plating rate.
Comparative performance data with conventional processes will be
presented, and production experience in both rack and barrel
installations will be described.
4:30 p.m._Influence of Surface Patterns of Substrates on the
Appearance of Electrodeposits
Chong Ho Sonu, J.R. Lee & Y.K. Kim, Research Institute of
Industrial Science & Technology, Pohang, Korea
Steel sheets as substrates for electrogalvanizing having different
roughness patterns manufactured by two different texturing
techniques, such as shot blasting (SB) and electro-discharge
texturing (EDT) were produced. the effect of the surface pattern of
substrate on the appearance of Zn and Zn-Ni alloy deposits was
investigated in terms of glossiness. This paper will discuss the
effect of surface patterns on the gloss of electrodeposits with
surface morphologies and phase structures.
Session Organizer: Harry J. Litsch, CEF-SE, H.J. Litsch
Consultants, Inc., Bethlehem, PA
Session Chairman: Dr. James Lindsay, General Motors
Research Laboratory, Warren, MI
8 a.m._Using Quality Teams to Promote Productivity
Fred Mueller, Pottstown Plating Works, Inc., Philadelphia,
PA
Both the ISO program and team building are being used to fuel the
improvements in Pottstown Plating Works' many departments. This paper
will report on the first six months of the company's progress toward
self-certification.
8:30 a.m._ISO Implementation Project with Metal Finishers
Christine A. Branson, Industrial Technology Institute,
Ann Arbor, MI
A report will be given on the progress of an ISO Environmental
Management System implementation project that is currently underway.
The project involves a group of metal finishers in an 18-month
process, highlighting environmental technology options and ideal
management practices for metal finishers. Information will be
developed to assist companies in diagnosing performance as well as in
identifying options and upgrades that can be used to improve
performance within the ISO 14000 Environmental Management System
requirements for continuous improvement.
9 a.m._How to Work for a "Jerk"
Tam Van Tran, Ionics, Inc., Watertown, MA
The workplace would be boring if there were no "jerks" around.
The "Jerk" makes us think, makes us work harder and be stronger,
provides unlimited entertainment topics, and makes us laugh. This
presentation will help you spot and identify the "Jerk" so you can
enjoy yourself and be successful in your career.
9:30 a.m._The Use of A.T.P for Quick Determination of
Throwing Power
Yair Assaf, Bohak Plating Co., Ltd., Hollon,
Israel
A.T.P. is a simple test panel that can be used at the plating tank or
in a small beaker right in the lab. The throwing power can be
obtained by comparing the plating thickness between the center of the
back and the center of the front panels. This highly reliable ratio
gives the throwing power, using the panel with a series of different
pulses, and yields good results very quickly.
10 a.m._Panel Discussion on Practical Applications
Panelists: S.O. "Skip" Cassell, Ames Metal Products,
Chicago, IL; Yair Assaf, Bohak Plating Co., Ltd., Hollon, Israel;
Jack Berg, SERFILCO, Ltd., Northbrook, IL; Gene Horvath, Custom
Master, Inc., Longwood, FL; Joseph Mazia, P.E., CMfgE, Mazia Tech-Com
Services, Chevy Chase, MD
Session Organizer & Chairman: Ron Parkinson, NiDI,
Toronto, Ontario, Canada
8 a.m._Nickel Electroplating Applications &
Trends
Dr. George DiBari, International Nickel Inc., Saddle
Brook, NJ
Nickel electroplating is one of the most versatile finishing
processes available, having a broad spectrum of end-uses that
encompass decorative, engineering and electroforming applications.
Although the main focus of this talk is on those applications,
economic, regulatory and quality assurance trends will also be
described to provide an overview of the current status of nickel
electroplating around the world.
8:30 a.m._Environmental Concerns in Nickel Plating
Dr. Gerald A. Crawford, consultant to the Nickel
Development Institute on Environmental Affairs
Owners/managers of nickel plating operations should be aware of
environmental issues in the workplace, including exposures of workers
to nickel-containing materials and disposal of aqueous effluents and
solid wastes containing residual concentrations of various nickel
compounds. Workers can be exposed to nickel in various forms by
breathing aerosols of soluble nickel salts suspended in the workplace
air and by skin contact with nickel compounds in solid form or as
aqueous solutions. This paper will summarize the health effects of
nickel-containing materials, exposure limits, preventive measures;
disposal of liquid and solid wastes; and risk assessment and
management as the proper bases for regulation of the industry.
9 a.m._The STEP Test_Tool for Improved Performance
Dr. Donald Snyder, Atotech USA, Inc., Cleveland,
OH
The STEP Test has developed into an excellent tool for research,
development and application of nickel electroplating. Corrosion
resistance, post-corrosion appearance and product quality have all
benefitted from the use of this easy-to-apply test.
9:30 a.m._Methods to Improve the Corrosion Performance of
Microporous Nickel-chromium Deposits.
Robert A. Tremmel, Enthone OMI, Warren, MI
During the last several years, microporous nickel-chromium
coatings have been severely scrutinized by the automotive industry.
Today, these coatings must be free of all surface defects, even after
long-term exposure to both accelerated tests and real-life service.
While proper control of all the multi-layer nickel deposits is
important, blemish-free surfaces can only be obtained when the
microdiscontinuity and the activity of the post nickel strike are
properly achieved and maintained. Our research will indicate that the
most important factor is the electrochemical potential of the strike
deposit.
Session Organizer: Linda Mayer, Lucent Technologies, Murray
Hill, NJ
Session Chairman: Dr. Joe Abys, Lucent Technologies,
Murray Hill, NJ
8 a.m._Issues on the Reliability of PWBs Metallized by
a Graphite-based Process
Michael Carano, Electrochemicals, Inc., Maple Plain,
MN
Questions about the long-term reliability of printed wiring boards
manufactured by direct metallization (DM) have arisen with a new wave
of DM technologies. This paper will address those issues in detail.
Performance data obtained from thermal cycling, thermal stress
DELCO-testing, components rework simulation interconnect integrity,
and plating adhesion, etc., will be presented. Process capability for
small hole plating (blind and buried) and exotic materials will also
be discussed. Sufficient background on the development of the
patented process will be given, along with the environmental
attributes of the system.
8:30 a.m._Solder Alternatives to HASL
James P. Langan, J.P. Langan & Associates, Inc.,
Red Bank, NJ
The high I/O interconnections required by recent innovations in
component technology are causing electronic manufacturers to
reappraise current assembly procedures. With ultra-fine pitch devices
mandating flat pads and a precise volume of solder on each lead, the
industry is now forced to seek alternatives to hot-air-solder-leveled
PWBs. A uniform tin/lead surface finish affords definite advantages
for tape-automated bonding and micro-ball-grid-array. This paper will
detail various processes that can provide this finish. Equipment
considerations will be outlined, as well as cost comparisons with
other alternatives, viz., precious metals, OSPs.
9 a.m._An Alternative Surface Finish for SnPb Solders: Pure
Tin
Y. Zhang & J.A. Abys, Lucent Technologies, Murray
HIll, NJ
Electroplated pure tin, bright or matte, has been used in the
electronic industry as an alternative for tin/lead finishes for its
excellent solderability and corrosion resistance. Whisker formation,
however, has often limited its application, especially in high
density semiconductor packages. It will be demonstrated that a
whisker-free elecroplated satin-bright tin finish can be obtained by
combining a proprietary chemistry and a unique plating technology.
The resulting finish has excellent ductility, solderability and a
stable grain structure. The properties of the tin finish and the
features of the plating process will be discussed.
9:30 a.m._Precision Plating of Tin/Lead Alloys for Flip Chip
Mounting Technology
Dr. A. Gemmler & W. Leonhard, Fraunhofer Institute
of Manufacturing & Automation; Dr. H. Richter & K. Ruess,
Alcatel SEL Research Center, Stuttgart, Germany
The deposition of bumps is a prerequisite for flip chip attachment of
bare dies. Bumping, which is mostly done on the ICs at wafer scale,
can be performed by microplating, vapor deposition or mechanical
methods. Within this work, a bumping process based on tin/lead alloy
plating will be presented. The high quality deposition of both the
eutectic and the lead-rich solder composition will be described, and
all key issues covering the equipment, electrolyte, and process
parameters will be discussed in detail.
10 a.m._Fountain Electroplating of Lead/Tin Solder for
Semiconductor Flip Chip Applications
Tom Ritzdorf & Bob Batz, Semitool, Kalispell,
MT
A study of lead/tin methane sulfonate plating baths has been
conducted for the purpose of maximizing the plating rate for useful
alloys onto silicon wafers in a fountain plating system. The best
candidate bath was chosen from an initial characterization to more
fully evaluate the plating characteristics and current density limits
for plating solder bumps on silicon wafers for flip chip
applications. The methodology used in this work consisted of a series
of statistically designed experiments, with the purpose of
determining the significant process variables and evaluating their
effects on the electroplated structures.
Session Organizer: Rich Dorset, Enthone-OMI, Stratford, CT
8 a.m._Electroplating Copper from an "Electroless"
Copper Plating Bath
Dr. S. Bharathi, S. Rajendran, V.N. Loganathan, C.
Krishna & K.R. Anandakumaran Nair, Lucas-TVS, Padi, Madras,
India
Cyanide-containing electrolyte is widely used as a strike bath
or to build up thick copper on substrates like mild steel, aluminum,
and zinc. Because of the highly poisonous and hazardous nature of
cyanide, conscious effort is being made to develop a suitable
non-cyanide formulation. This paper will describe the development of
a non-cyanide alkaline copper plating bath from an alkaline tartrate
solution with amine- and sulfur-containing additives. Also described
will be the influence of various parameters like additive
concentration, current density and surface preparation.
8:30 a.m._Electroless Nickel-Cobalt-Phosporous: A New
Wear-Resistant Process
Mark W. Zitko, Enthone-OMI Inc., New Haven,
CT
A new electroless nickel-cobalt-phosphorous plating process has been
developed. It produces a wear- and corrosion-resistant hard deposit.
Using a Design of Experiments (DOE), it was determined that any
desired Ni-Co-P alloy can be achieved. Heat treatments were done on
the various alloys to determine the highest hardness and the best
wear resistance. The results of Taber and Falex Wear tests and
corrosion studies will be discussed.
9 a.m._Electroless Nickel Coatings in Process Safety
Management of Chlor-alkali Plants
Mary Mukhtarian, Robert Tracy & Jerry Evarts,
Occidental Chemical Corporation, Dallas, TX
Corrosion rates of electroless nickel (EN) will be compared with
several common alloys in 50% sodium hydroxide under reflux (143 _C)
and with nickel alloy 200 under velocity. The results will show that
low phosporous(LP) EN has lower corrosion rates than nickel alloy 200
and many other commonly used alloys. In addition, heat treatment of
LP-EN dramatically improves its corrosion/erosion resistance. The
data will show why many chlor-alkali producers experience a large
improvement in the service life of equipment coated with EN.
9:30 a.m._Wear-resistant Electroless Nickel: Practical
Applications
Glenn O. Mallory, Electroless Technologies
Corporation, Los Angeles, CA; Dr. Gary Loar, McGean-Rohco, Inc.,
Cleveland, OH; & Roger Vojinov
A new, very hard electroless nickel that provides improved
wear resistance was introduced in November 1995. As a continuation of
that study, practical applications of this coating have been made.
This presentation will review the coating (Deposit H) and offer data
and observations from trials performed under actual operating
conditions in the field. These data will confirm the wear
characteristics of Deposit H that were previously reported from
laboratory tests.
Session Organizer & Chairman: Linda Mayer, Lucent
Technologies, Murray Hill, NJ
1 p.m._Electromigration of Metallic Coatings in
Electronics
Simeon J. Krumbein, AMP Inc., Harrisburg,
PA
A review of electromigration will be presented in terms of the
phenomena that adversely affect the performance and reliability of
electronic packages and components that contain metallic coatings.
Included will be discussions of the characteristics of the main
electromigration mechanisms and of the various factors that increase
the susceptibility of such coatings to electromigration. The primary
emphasis will be on electrolytically-controlled processes at
near-ambient conditions.
1:30 p.m._Assessment of the Coatings of Precious Metals Using
Sequential Electrochemical Reduction Apparatus
Peter Bratin, M. Pavlov, G. Chalyt, E. Izro & R.
Gluzman, ECI Technology, East Rutherford, NJ
A new application of SERA method to assess the surface conditions of
coatings of the precious metals will be presented. The effect of a
substrate barrier layer on the surface conditions will be evaluated.
Experimental results obtained from different types of products coated
with precious metals will be discussed. The influence of the elevated
temperatures and humidity on the coatings of precious metals will be
shown.
2 p.m._Assessment & Methods of Gold Microhardness
Pamela A. Harper & Dr. I-yuan Wei, AMP, Inc.,
Harrisburg, PA
Currently, the 25 gram Knoop microhardness test is predominant in the
microhardness testing of gold-plated specimens. Although the use of
hardness results is becoming increasingly more important in the
industry, there are several major problems that must be addressed. A
small-scale round-robin study was conducted to determine the
repeatability and reproducibility limits of the Knoop test on gold
plate. Results from two types of samples will be reported:
Pre-mounted, pre-indented, read-only coupons, and pre-mounted, indent
and read coupons. In addition, several laboratory methods for
preparing test specimens will be discussed.
2:30 p.m._Electrodeposition of Magnetoresistive Co-Cu(Sb)
Multilayers
N. Lecis & P.L. Cavallotti, Dip.Chimica Fisica
Appl. Politecnico di Milano, Milano, Italy
Electrodeposition is one of the simpler and cheaper processes
available for the fabrication of thin metal films. Recent
developments have made it possible to electrodeposit a wide range of
nanostructurate materials, including many that exhibit giant
magnetoresistance (GMR). Two techniques will be described that can be
used to produce multilayers from plating baths: The dual bath
technique and the single bath technique. The second is preferentially
used because, by using a single electrolytic to deposit both
components of a metal/metal superlattice, any contamination that
could result from exposure to atmosphere during transport between
electrolytes is avoided. A report will be given on the
characterization of electrodeposited Co-Cu(Sb) multilayers grown in a
single electrolyte based on CoSo4 and CuSO4.
3 p.m._Electroless Nickel & Immersion Gold for
Microelectronic Packaging Devices
Masayuki Kiso, C. Uyemura Company, Ltd., Osaka,
Japan
This paper will discuss the properties of electroless nickel and
immersion gold when used on microelectric packaging devices such as
P-BGA, C-BGA, CSP, and flip chip. Phosphorous electroless nickel is
the preferred finish when combined with 0.2 - 0.7 Êm of
immersion gold. The discussion will focus on: The uses of electroless
nickel and immersion gold for isolated patterns; wire bonding and
solderability characteristics of the deposits; and the percentage of
P in the electroless nickel deposit and its influence upon the
desired film properties.
3:30 p.m._Intrinsic Mechanism in Immersion Gold Plating
Keith Kwong Hon Wong, Srinivasa N. Reddy, IBM
Microelectronic Division, Hopewell Junction, NY
Although immersion plating has been used extensively in industries,
there are relatively few published studies on the reaction mechanism.
The process is simple and cheap, but it can lead to porous and
non-adherent deposits to the base metal if done improperly. This
presentation will outline some of the electrochemical aspects of
immersion gold plating, with emphasis on the material and surface
nature of the base metals.
Session Organizer: Ron Parkinson, NiDI, Toronto, Ontario,
Canada
Session Chairman: Bob Srinivasan, EPI Electrochemical
Products, Inc., New Berlin, WI
1 p.m._Nickel Recovery for Duplex Plating
Operations
Mike Sheedy, P.E., Prosep Technologies, Pickering,
Ontario, Canada
When recovering nickel from duplex nickel plating rinsewaters,
two things are important to consider: The purity level of the
recovered salt that allows return to the semi-bright plating bath,
and the need to overcome cathode/anode inefficiencies, which increase
nickel concentration in the baths as plating continues. A unique ion
exchange system that produces a pure, concentrated, pH-adjusted
chloride/sulfate nickel salt will be described. Also, details
concerning a membrane-protected insoluble anode to allow total
recycling will be presented. Case study information pertaining to
performance, operating details, and design considerations will be
addressed.
1:30 p.m._Design Flexibility with Satin Nickel Plating
Gerd Schîngen, LPW Chemie GmbH, Neuss,
Germany
This paper will outline the various satin nickel design features
obtainable from a single nickel sulfate/nickel chloride plating
system. In this system, three or more uniform, silk-matte,
non-dazzling fine crystaline structures with varying degrees of
brightness or smoothness can be produced by changing a single
chemical additive. The system does not require thermal cycling. Also
discussed will be the physical characteristics of the satin nickel
deposit, a comparison of test results against those achieved through
normal bright nickel plating, and the advantages that this system
offers over other methods of satin nickel plating.
2 p.m._Plating of Automotive Aluminum Wheels
Douglas E. Lay, CEF, TASKEM, Inc., Cleveland,
OH
Automotive designers are again incorporating bright trim to the
interior and exterior of automobiles in an attempt to enhance the
overall aesthetics. One area that has an immediate impact on
aesthetics is the wheel, and automobiles are being marketed with
aluminum wheels electroplated with nickel/chrome as standard
equipment. This paper will address the aluminum preparation sequence
and discuss the plating requirements, specifications and process
steps required to provide a finish with superior corrosion and impact
resistance, in addition to aesthetics.
2:30 p.m._Panel Discussion
Panelists: Dr. Gerald Crawford, Nickel Development Institute;
Dr. George DiBari, INCO, Ltd.; Douglas Lay, CEF, TASKEM, Inc.; Gerd
Schîngen, LPW Chemie GmbH; Mike Sheedy, P. Eng., Prosep
Technologies; Dr. Donald Snyder, Atotech USA, Inc.; Roger Timmer,
Lacks Industries, Inc.; & Robert Tremmel, Enthone-OMI.
Session Organizer & Chairman: Beldon Hutchinson, LDC,
Inc., Cleveland, OH
1 p.m._Brush Plating Trivalent Chromium
B. Hutchinson & Z. Mathe, Liquid Development
Company, Cleveland, OH
Of the various techniques available for depositing coatings,
brush plating has certain advantages, such as localizing the
deposition process and the ability to control the chemistry and
operating conditions of the relatively small volumes of solution
used. Data on the brush plating of trivalent chromium and its
properties will be presented.
1:30 p.m._Brush Nickel Plating Railroad Axles
Jone M. Rodgers, Metallize Illinois, Inc., Vandalia,
IL
The Association of American Railroads specification M-967-80
outlines the brush plating repairs for railroad axles. The
specifications must be adhered to in every detail contained in this
document. No other repairs or changes are permissible. The
certification of job shops is stringent, and unannounced inspections
are carried out by the AAR inspectors.
2 p.m._Brush Plating Mistakes Made & Corrections
Taken
David Barclay Sr., Dalcan Services Limited,
Burlington, Ontario, Canada
Combining human nature with a technical process like brush
plating creates a fertile breeding ground for both human and chemical
errors. Since its mid-century inception, brush plating has made great
advancements through chemistry, metallurgy and power supply. Not
surprisingly, the skill level of the human brush plating technician
has had to improve as well. Problems and mistakes, such as improper
choice of plated material or improper identification of base
material, often plague the brush plating process. This paper will
discuss these and other common mistakes and suggest what corrections
can be made to complete a successful job.
2:30 p.m._The Use of Selective Plating in Aircraft
Maintenance
Danny L. Martin, Erickson Air-Cane, Central Point,
OR
The selective plating ("brush plating") process is both necessary and
cost-effective in airframe and powerplant repairs. This process is
ideal for plating small areas of extremely large parts, restoring
worn, corroded, or over-machined parts back to size, and for
minimizing disassembly and machining costs, to name a few. Often,
component repair is limited by the operator's ability to employ the
many repair procedures that are available. In this discussion, one
aircraft and one engine will be considered in relation to the
detailed procedures outlined by aircraft and engine manufacturers and
the US military, as they pertain to the areas of repair where brush
plating may be used.
3 p.m._Minimizing Hazardous Waste Generation in Brush
Plating
W.R. Wachtler, P.E., WR Associates, Inc., Encinitas,
CA
Reverse machining has lately become the major use of the brush
plating process. For lighter repairs, chemicals were designed to
evaporate at the rate that the metallics were used from the solution,
generating only minimal waste. Used in heavier repair work, however,
the solutions lose their controlled buildup capability before the
carrier chemicals can evaporate. A significant amount of rinse water
is used in this process, and the amount of hazardous waste generated
exceeds the amount of spent solution to be disposed of. This paper
will cover the new techniques available to segregate and minimize the
hazardous waste generated by the process, which will, in turn, reduce
the cost of that waste disposal.
3:30 p.m._Brush Plating_An Overview
Beldon Hutchinson, Liquid Development Co., Cleveland,
OH
This paper will address the use of brush plating and how it can be
used to reduce or eliminate hazardous waste during the preparation of
various base materials_with or without chemicals. The discussion will
also include how to use the brush plating electrolytes for their
entire useful lives. It will define the terminology of brush plating
and explain how it is used in this industry.
Session Organizer: David Barrack, NAMF, Reston, VA
Metals are one of the largest single production inputs for
metal finishing operations. The prices paid for this input can vary,
based on world market conditions. This "Outlook 1996" will examine
the changing dynamics of the metals market from the perspective of
the metal finishing industry. The Metals Market Outlook will provide
information on anticipated changes in the markets for important
non-ferrous metals and an overview of how metal finishing facilities,
both large and small, can anticipate the market and make the most out
of their strategic buying power.
Representatives from the major metals producers, important brokers
and others will predict the state of the markets for 1996 and
beyond.
Session Organizer & Chairman: Dr. Eric Brooman,
Concurrent Technologies, Inc., Johnstown, PA
8 a.m._Overview of the Important Characteristics &
Properties of Chromium Coatings
D.A. Schario, D.S. Viszlay & E.W. Brooman,
Concurrent Technologies Corporation, Johnstown, PA
Hexavalent chromium coatings are used in a wide range of functional
and decorative applications. Because of environmental regualtions,
the use of plating baths containing hexavalent chromium is of
concern. An overview will be provided of the reasons for change, and
the current efforts to develop acceptable trivalent or alternative
chromium coatings.
8:30 a.m._The Mechanisms of Chromium Plating
N.V. Mandich, HBM Engineering, Lansing, IL
Even though the electrochemical mechanism used during chromium
plating has been around for 75 years, its use is still open for
conjecture. The present status of the theory will be explained, and
kinetic aspects and the role of alkyl sulfonic acid as a catalyst
will be presented. A discussion on the complex chemistry of trivalent
and hexavalent chromium compounds will also be included.
9 a.m._A Review of Decorative Trivalent Chromium
Electroplating
Dr. D.L Snyder, Atotech USA, Inc., Cleveland
OH
Over the last 20 years, trivalent chromium electroplating has proven
to be an environmentally friendly and productive process when
compared to hexavalent chromium plating. The factors contributing to
this success will be discussed.
9:30 a.m._Trivalent Chromium Coatings Applied by Brush
Plating
Beldon Hutchinson & Zoltan Mathe, Liquid
Development Company, Cleveland, OH
Of the various techniques available for depositing coatings, brush
plating has certain advantages, such as localizing the deposition
process, and the ability to control the chemistry and operating
conditions of the relatively small volumes of solution used. Data on
the brush plating of trivalent chromium and its properties will be
presented.
10 a.m._The Engineering Properties of Hard Trivalent Chromium
Functional Deposits as Deposited from a New Bath
V.N. Kudryavtsev, E.G. Vinokurov & O.E. Azarko,
Eaton Corporation, Milwaukee, WI
Hard chromium deposits are electrolytic and dependent on processing
conditions. Trivalent chromium deposition is no different in this
respect. Data will be presented on the influence of electrolytic
conditions on the properties of trivalent chromium deposits from a
new plating bath. Hydrogen, oxygen and carbon content of the deposits
will be discussed, as well as internal stress, hardness, and wear
resistance. Efforts to correlate conditions with properties will be
discribed.
10:30 a.m._Functional Chromium Plating from a Trivalent
Chromium Bath
R.P Renz, C.D. Zhou, E.J. Taylor, R.G. Marshall, E.C.
Strotz & B. Grant, Faraday Technology, Inc., Dayton,
OH
Trivalent chromium baths have numerous environmental heath
advantages. To date, such baths have not been widely used because of
the difficulty in obtaining thick deposits with appropriate
properties. A novel process will be described that provides
comparable thicknesses, high plating rates and current efficiencies,
and equivalent hardnesses compared to conventional, hard chromium
deposits.
Session Organizer: Linda Mayer, Lucent Technologies, Murray
Hill, NJ
Session Chairman: James P. Langan, J.P. Langan &
Associates, Inc., Red Bank, NJ
8 a.m._An Environmentally Friendly Method for Plating
Semiconductor Components: Palladium Lead Frame Plating
R. Schetty, LeaRonal, Inc., Freeport, NY
Conventional plating of semiconductor components involves the use of
hazardous, environmentally unsound chemicals such as cyanide and
lead. In order to reduce the exposure of manufacturing personnel to
such harmful elements and to restrict the release of these chemicals
into the environment, an environmentally friendly alternative plating
method is required. Palladium plating of lead frames is a viable
method for electroplating semiconductor components without cyanides
or Pb. The background, plating sequence, deposit characteristics, and
practical implementation of this technology compared to conventional
plating methods will be discussed in detail.
8:30 a.m._Application-specific Surface Finishing Technique
for Leadframes
I. Kadija, J. Abys, C. Fan, F. Humeric & I.
Boguslavsky, Lucent Technologies, Murray Hill, NJ
Leadframe fabrication, including the surface finishing, must meet a
variety of functional capabilities. In addition to solderability and
wirebonding, leadframes must be engineered to withstand trim-and-form
operation and a corrosive environment, regardless of the substance
quality. In this article, we will describe our new developments in
the field of formability and corrosion protection of leadframe
substrates.
9 a.m._A High Temperature Electrical Contact Finish for
Automotive Applications
E.J. Kudrak, J.A. Abys & V.A. Chinchankar, Lucent
Technologies, Murray Hill, NJ
An electroplated finish for use in high reliability electronic
connectors has been developed. It can withstand 200 _C for more than
2000 hours with no measurable changes in contact resistance. Data
will be presented for several common precious metal finishes,
including two palladium-based finishes, shown to be extremely stable
under these conditions. The contact resistance will be measured at
dry circuit conditions according to ASTM B667-92, Standard Practice
for Construction and use of a Probe for Measuring Electrical Contact
Resistance, at 25, 50, 75 and 100 gram loads.
9:30 a.m._EMI-RFI Shielding with Direct-Plate Technology
Dr. Nayan Joshi & Dr. Hermann Middeke, Atotech
USA, Inc., Somerset, NJ
The increasing importance of conductive coatings for EMI-RFI
shielding has resulted from the greater use of plastics materials in
electronic product design. Although electroless copper plating is
functionally superior to and economically competitive with other
coating methods, it employs a number of substances that are harmful
to the environment. Heightened environmental awareness has prompted
the development of an alternative process that produces dense,
copper-rich, electrically-conductive film on the non-conductive
substrates. It is compatible with most of the commonly used resin
materials, and has shown good potential for the direct metallization
of molded plastic parts, large bare laminates, fabrics, and also for
selective metallization on the specifically molded polymer parts.
10 a.m._A New Palladium Plating System for Decorative
Purposes
I. Boguslavsky, J.J. Maisano, J.A. Abys, B.F. Stacy
& V.T. Eckert, Lucent Technologies, Murray Hill, NJ
A novel palladium plating system provides a low maintenance
bath with high efficiency, neutral pH, and consistently plated
specular and ductile deposits up to thicknesses of 10 microns.
Deterioration of the deposit appearance over the lifetime of the bath
depends on plating conditions, metallic and organic contaminants, and
breakdown products of the bath components. The most important factor
affecting the deposit appearance is the presence of decomposition
products that are intrinsic to the bath chemistry. This paper will
discuss the analytical control, operation and maintenance processes
that were used to develop this long-lasting palladium plating
chemistry for decorative purposes.
Session Organizer & Chairman: Dr. Fred P. Reinhard,
EG&G Environmental, Inc., Bloomington, MN
8 a.m._Liquid Cleaners
Stephen F. Rudy, Frederick Gumm Chemical Company,
Inc., Kearny, NJ
Liquid cleaners are environmentally safer alternatives to
traditional cold, hydrocarbon and chlorinated solvents. There are
some process modifications to consider with liquid cleaners, such as
heating, cleaning application, time, and drying. By selecting the
appropriate process chemistry, the cleaning effectiveness equals or
surpasses that of solvents. Liquid cleaners are readily adaptable to
soak, spray, or ultrasonic equipment. Field applications for liquid
cleaners have increased, and the practical benefits of using them
include operating cost savings, greater safety, easier handling,
excellent process control, and reduced sludge generation.
8:30 a.m._Electroplating from Additive-free Baths
C.D. Zhou, R.P. Renz, E.J. Taylor, E.C. Stortz &
B.J. Grant, Faraday Technology, Inc., Dayton, OH
Current state-of-the-art metal plating relies on baths containing
proprietary additives. These additives affect the plating process to
yield electrodeposits with the appropriate properties for thier given
applications. Because the additives and their decomposition products
adversely affect the rinse operation, the rinse water can not be
recylcled to rinse operations. A new, additive-free bath allows the
recovery and in-process recycle of rinse waters and plating baths,
enabling closed-loop, environmentally conscious metal plating.
9 a.m._Trends in Waste Treatment in Electroplating in
Japan
Dr. Tadao Hayashi, University of Osaka Prefecture,
Japan
Recent recycling and recovery technologies in the Japanese
electroplating industry will be discussed. Some of the various
effluent treatment systems in Japan_closed, econoback and
cartridge-type ion exchange recycle systems_will be mentioned in
detail. On-line alarm systems in waste water treatment in plating
jobshops will also be discussed.
9:30 a.m._International Shipment of Hazardous Waste Ban: Free
Trade . . . NOT!
Dr. Paul Piplani, R.E.M., TTX Environmental, Sturgeon
Bay, WI
The Basel Convention was created in 1989 in response to
shipments of questionable unidentified hazardous waste shipments that
were being sent from developed countries like the United States to
poor countries like China, India, Bangladesh and Indonesia. The
receiving countries were not aware of the contents of these waste
shipments, or of the correct methods of handling or managing them. In
late 1995, the 100 nations belonging to the Basel Convention voted to
phase out the movement of wastes accross international borders by
January 1998. This paper will outline the contents of the new
amendment, and will focus on the issues pertaining to the
"Not-in-my-backyard," as well as the self-suficiency principles.
10 a.m._European Chemical Regulations
Dr. Xavier Albert Ventura, LC Systeme Iberica, S.A.,
Barcelona, Spain
Human protection of the environment and the risks of chemical
products will be discussed. International, national, regional and
local regulations pertaining to areas such as the monitoring of means
(products, manufacturing, etc.), the regulation of production
(packaging, labeling, etc.), and the classification of substances
will also be analyzed.
10:30 a.m._Health & Safety Program Integration
Philip A. Platcow, C.I.H., Sedgwick James, Boston,
MA
On-going cutbacks many leave large companies with skeleton industrial
hygiene and safety staffs, but smaller firms now have only a single
individual or no full-time professional at all to maintain the health
and safety integrity of a firm. This creates a liability risk
potential that must be addressed. These firms are now relying on
outside consultants and the concept of "health and safety program
integration." This paper will explore these ideas and present the
results of comparable companies.
11 a.m._The Cost-effective Use of Chemical Fixation to
Remediate Soils Contaminated from Metal Processing Operations
Dr. David J. Leu, Clayton Environmental Consultants,
Inc., Laguna Hills, CA
The remediation of soils contaminated from metal processing
operations has traditionally been an expensive undertaking. Such
cleanups have usually relied on the use of hazardous waste landfills
to dispose of the contaminated soils. A lower cost approach, which
also reduced the offsite, long-term liability exposure, is the use of
chemical fixation. This way, the soil can be treated onsite, rendered
nonhazardous, and reused as a clean backfill. If offsite disposal of
chemically fixated soils is preferred, such soil can be sent to a
nonhazardous landfill. Two case studies will be presented that will
demonstrate the cost-effectiveness of chemical fixation.
Session Organizer & Chairman: Donald M. Mattox, Society
of Vacuum Coaters
8 a.m._An Overview of PVD Processing &
Applications
Donald M. Mattox, Society of Vacuum Coaters,
Albuquerque, NM
Physical Vapor Deposition (PVD) processes are atomistic thin
film deposition processes in which material vaporized from a source
is transported in the form of a vapor through a vacuum or low
pressure gaseous environment to the substrate where it condenses. PVD
processes can be used to deposit single or multilayer films of
elements and alloys. Compound materials can be deposited by the
reaction of depositing material with the ambient gas environment or
with a co-deposited material. This paper will review the basic
technology and applications of the principal PVD processes of vacuum
deposition, sputter deposition, and ion plating.
8:30 a.m._Physical Vapor Deposition Wear-resistant &
Decorative Coatings
Mark Podob, Richter Precision, Inc., East Petersburg,
PA
PVD is a group of coating processes used to apply functional
hardcoatings and decorative thin films. The coatings have a low
coefficient of friction, are chemically resistant, and can act as
chemical and thermal barriers. Applied in either single or multiple
layers, the coatings can be used in a variety of industries, and
provide different benefits depending on the application. This
presentation will describe the properties of the coatings and discuss
their various functional and decorative applications.
9 a.m._Case Study: Lifetime Anti-tarnish Finish
S.K. McKenzie, Vapor Technologies, Inc., Boulder, CO;
W. Thomasson, Weiser Lock & J. Kostura, Masco
Corporation
This paper will review the development and launch of a lifetime
anti-tarnish finish that has been recently introduced to the
residential door lock market. This case study will compare Weiser
Lock's testing results for some PVD coating processes with low
temperature arc vapor deposition (LTAVD), as well as discuss critical
issues of cleaning and PVD processes.
9:30 a.m._Wear & Corrosion-Resistant Decorative Hard
Coatings in Large Volume PVD Units
T. Hurkmans & F. Hauzer, Hauzer Techno Coating
Europe B.V., The Netherlands
The combined steered arc/unbalanced magnetron technology has proven
to be valuable in hard coating. In high number, low temperature and
cost-effective production volumes, there is a strong demand for high
throughput in PVD deposition. Multiple cathodes can be connected by
optimally shaping the vacuum chamber, and systems configured with the
cathodes in large doors are available for easy maintenance access.
Fast pump-down and reproducible process pressures are reached by a
combination of turbo pumps and roughing pumps. Other features of this
technology, including the use of individual cathode shutters,
radiative heaters, and roll-in/roll-out turntables, will be discussed
in this paper.
10 a.m._Functional & Decorative Coatings by Physical
Vapor Deposition
Robert R. Aharonov, Multi-Arc, Inc., Rockaway, NJ
Applications of PVD coatings as complimentary/replacement
alternatives to the coatings in the electroplating industry will be
addressed in this paper. The principles of vapor deposited coatings
will be briefly introduced, but focus will be on cathodic arc (CA)
and unbalanced magnetron sputtering (UBM) coatings. Superior
adhesion, high hardness, and the "green" nature of the vacuum
processes make the coatings attractive to various application fields
where electroplating has been traditional. Several successful
applications will be presented.
10:30 a.m._PVD Chrome as a Replacement of Hexavalent
Chrome
Dr. Brent Lee, Vacuum Plating Technology Corp., San
Jose, CA
To date, vacuum-based technologies have only been able to deposit
thin films. A novel process will be described that uses a
PLC-controlled, cathodic arc plasma depostition process to provide
decorative and functional chromium coatings. As an option, a coat of
ZrN or tin on top of chrome can be used to enhance color and luster.
Metallographic data, salt spray and Taber Abrasion test results will
be discussed.
11 a.m._The Least You Should Know About Color
Greg Caskey, Lakeshore Physics & Analytics,
Holland, MI
How do you know that your product's color is right? What
should you keep in mind when comparing color of production parts with
customer color standards? Why is color matching difficult? This talk
will answer these and other questions about color, color matching,
and the language used to qualify color. Other areas of focus will be
light sources, colorants and pigments, surface texture, metamerism,
and inspection methodology.
Session Organizer: David Barrack, NAMF, Reston, VA
This "Outlook 1996" seminar will feature representatives from
National Environmental Strategies (NES). NES is a Washington,
DC-based consulting firm that represents the surface finishing
industry on environmental, regulatory and legislative matters.
Seminar attendees will be briefed on the direction of environmental
legislation and regulatory policies relative to all surface finishers
and suppliers.
Election-year politics will also be discussed. Particular emphasis
will be placed on the leading candidates' positions regarding
environmental issues.
Session Organizer: Dr. Fred P. Reinhard, EG&G
Environmental, Inc., Bloomington, MN
Session Chairman: Peter Gallerani, CEF, Integrated
Technologies, Inc., Danville, VT
1 p.m._Selective Ion Exchange Resins in Effluent
Polishing Systems
Philip Fatula, BAYER Corp., Pittsburgh, PA
Selective ion exchange resins have been successfully employed in the
US to recover valuable metals from many metal-containing waste and
wastewater streams. The commonly used chelating iminodiacetic
acid-using resins, however, have not found widespread application in
waste stream polishing systems. Historic data on the treatment
quality and cost-effectiveness of these systems will be presented to
demonstrate their applicability in the US market.
1:30 p.m._Use of a NASA-Developed Ion Exchange Material for
Toxic Metal Removal from Electroplating Baths
M.J. Ginther, J.T. Folkers, O.M. Uy, Johns Hopkins
University/APL, Laurel, MD; K. Street, NASA Lewis Research Center,
Cleveland, OH; & J. Naumann Jr., A-1 Plating Company, Baltimore,
MD
A new polymer developed by NASA has been used to significantly reduce
toxic metals effluents from rinse baths. Originally developed as a
battery separator for space application, the active ion exchange
material is a polymer made from polyacrylic acid and polyvinyl
alcohol and converted to the calcium form. Data will be presented on
the absorption efficiencies of the ion exchange material for metals
such as zinc, copper, cadmium and lead. The removal of these toxic
metals with a portable ion exhange filtration system will be
discussed, and estimates of the labor and city water savings incurred
in the process will be presented.
2 p.m._Simultaneous Multi-Metal Recovery with a Proprietary
Process
C.D. Zhou, E.C. Stortz, E.J. Taylor, R.P. Renz &
T. Sousa
Faraday Technology, Inc., Dayton, OH
Industrial wastewater usually contains several heavy metals, the
elecrochemical recovery of which promises to be a viable approach for
metal recycle. Unfortunately, conventional electrochemical methods
are not efficient in treating dilute wastewater, and metals with
higher negative reduction potentials are difficult to recover. A
process is being developed that will efficiently and simultaneously
remove multiple metals regardless of different reduction
potentials.
2:30 p.m._Achieving A Closed-loop System While Recycling
Water & Cleaner
Greg Savage, Membrex, Inc., Fairfield, NJ
During the pre-treatment process, parts are cleaned by solvents or
aqueous cleaners. By incorporating filtration techniques such as
ultrafiltration, the aqueous cleaning system can become a closed-loop
system by filtering out the solids and oils and reusing the water and
cleaner. Filtering the wash water can also be accomplished using
ultrafiltration. This paper will discuss the filtration options, pros
and cons to each option, and tips on how to make sure a system will
work.
3 p.m._Wastewater Recycling for Electronic Plating
Kuo-Ruey Huang & Shan-Nan Lee, ITRI Taiwan,
Chiu-Kwei Huang & Jung-Chung Tsao, PHILIPS E.B.E.I.,
Taiwan
A new recycling system uses ion exchange technology to recycle 99
percent of rinsing water. The resulting water quality is superior to
that of the current system. Details of the system's operation will be
discussed, and the cost savings and return on investment attained
while using it will be analyzed.
3:30 p.m._Hexavalent Chrome Emission Testing Program:
Assisting Metal Finishers in Meeting the 1995 Chrome MACT
Standard
Jim Hensley, Industrial Technology Institute, Ann
Arbor, MI
A pilot prevention/demonstration project focusing on meeting the 1995
Chrome MACT standard for hard chrome plating shops was undertaken
under a combined National Institute of Standards & Technology and
EPA Common Sense Initiative in the metal finishing sector. Four
small/medium shops are participating in a 3-phase project that will
include baseline testing of chrome emissions, development and
implementation of modifications and upgrades, and post-modification
testing to document the effectiveness of the changes. Baseline
testing results and peer-reviewed modifications and upgrades will be
discussed.
Session Organizer & Chairman: Robert Mikkola, CEF,
Martin Marietta Energy Systems, Oak Ridge, TN
8 a.m._Pulse Plating
Dr. Per Moller, Peter Torben Tang, M.Sc. & Dr.
Peter Leisner, Technical University of Denmark, Lyngby,
Denmark
This video presentation will give a general introduction to the pulse
plating technique. Important theoretical principles such as
capacitative effect, nucleation and mass transport will be discussed
together with numerous practical examples of the influence of pulsed
current on the electrodeposition of chromium, copper and nickel.
Pulse plating of other metals, like silver and gold, will also be
illustrated. The video will also include a discussion of pulse
rectifiers.
8:30 a.m._Important Parameters & Applications for Nickel
Electroplating
Peter T. Tang, M.Sc., Frank Fontenay, M.Sc. & Dr.
Per Moller, Technical University of Denmark, Lyngby,
Denmark
This presentation will concentrate on the important mechanical and
chemical parameters of nickel electroforming. Electrolyte parameters
such as current density, the use of pulse plating and additives, pH
value and temperature will be examined with respect to mechanical
properties such as internal stress, material distribution and
hardness. Very different applications will be used to illustrate
these important parameters.
9 a.m._Electrodeposition of Ni from a Sulfate Electrolyte
Using Pulsed Current
Dr. Jean Rasmussen, Metal Pioneer Finishing, Green
Bay, WI & Else Hansen, Danfoss, A/S, Nordborg, Denmark
The presentation will contain results from tests involving Ni
deposition from a sulfamate bath using DC. and square-waved pulse
currents at different electrolyte temperatures. The paper will report
on the deposition rate, material distribution and current efficiency,
and it will give a crystallographic analysis of the grain size,
crystal orientation and internal stress.
9:30 a.m._The Use of Fractally-Designed Wave Forms in
Electroforming
Jonathan S. Bullock, Roger L. Lawson & John R.
Kilpatrick, Lockheed Martin Energy Systems, Oak Ridge, IN
Pulsed electrodeposition offers the potential for superior control of
deposit properties because of additional control variables available.
These additional variables, however, make the optimization of pulsed
deposition processes challenging. One method for global optimization
that may, for example, control surface irregularities on several size
scales, uses a periodic reverse design based on a fractal time
series. This incorporates deplating pulses of several lengths within
one self-similar waveform. The creation of such waveforms, their
properties, and thier use in a lead-plating process will be
described. Speculation on the potential for further application of
this method will be offered.
10 a.m._Electrodeposition & Magnetic Behavior of Co-Co
Multilayered Thin Films Subject to Low-Temperature Annealing
Dr. David Lashmore & Susan Hua, Materials
Innovation, West Lebanon, NH
The electrochemical deposition of cobalt-copper multilayers
will be described and the dependence of their magnetoresistivity on
layer thickness and deposition parameters will be presented. For a
wide variety of layer thicknesses electrochemically produced, Co
(Cu)-Cu thin polycrystalline layered alloys exhibit a giant
magnetoresistivity (GMR). Annealing studies of Co-Cu multilayered
thin films, deposited on various substrate mateials, show that there
exists an unexpected enhancement of both the magnetoresistivity and
the magnetic sensitivity. This behavior is correlated with a
combination of grain growth and grain boundary diffusion. A break-up
of the layered structure occurs, enabling a magnetostatic coupling
contribution to the GMR behavior. We observe a quasilinear GMR
response (low-sensitivity material) or a non-linear (high-sensitivity
material), depending upon deposition parameters. The major deposition
parameter affecting this behavior is mass transport. Substrate grain
size, layer spacing and annealing history, however, also play an
important role.
Session organized by the Society of Manufacturing Engineers
(SME)
Session Chairman: Ken Kreeger, Nordson Corp., Amherst, OH
1 p.m._Powder Coatings_A Customer Analysis
Paul D. Lovett, P.D. Lovett & Company Management
Associates, Allentown, PA
In contrast to the coatings industry overall, powder coating is an
exciting growth segment of the market. Domestic sales of powder and
related equipment are already apporaching $1 billion annually, and
they exceed that amount in other parts of the world, particularly
Europe. A good economy has stimulated conversions to powder coatings
in recent years, but growth of this technology will be sustained,
because it is founded on a basic restructuring of the coating market.
Although competitive positioning has hurt profits for some, those who
sustain and grow their businesses will be rewarded by a strong market
position that will generate cash.
1:30 p.m._Powder Coating: A Comparison of the European &
American Approaches
John P. Birch, John Birch Associates, Warwickshire,
England
This paper will explain the differences between the American
and the European powder coating industries and show how the gap
between them is narrowing. It will also look at some reasons for the
success of bonding metallic pigments to powder coatings and examine
some typical applications.
2 p.m._Electrophoretic Lacquering
Chris Mayhew, W. Canning, Inc., Palatine,
IL
An electrophoretic lacquering process of the cathodic type will be
described. Deposition is from an aqueous disperson of a polyacrylate
resin bearing amino and blocked isocyanate functionalities. The resin
deposit can yield a durable coating with the excellent throwing power
of this type of process. A particularly attractive feature is the
ability to dye the uncured colorless resin deposit, enabling a range
of colors to be produced from one lacquering stage. A method of
operating the process to give virtually zero discharge of resin will
be described.
2:30 p.m._Powder Clearcoats
Dr. Paul H. Pettit, Jr., PPG Industries, Inc.,
Strongsville, OH
Clearcoat technology is well-established for liquid coatings,
and clearcoats are used by a large variety of industrial end-users,
utilizing a broad range of coating technologies and chemistries,
including acrylic, epoxy, polyester and urethanes. These are applied
either as 100 percent solid liquid coatings, water-based or
solvent-based finishes. The use of powder clears, including both
optically clear, as well as color-tinted clears, has not yet been
fully exploited, as a result of certain practical limitations of
powder clears. As new powder technology is developed, expanding the
existing chemistry and application technology base, powder clears
will become more widely used in the industrial coatings markets.
3 p.m._Fundamentals of Pretreatment for Powder Coating
Applications
Brad Gruss, Fremont Industries, Inc., Shakopee, MN
3:30 p.m._Spray Applications for Powder Coating
Ken Kreeger, Nordson Corp., Amherst, OH
Session Organizer & Chairman: Sue Packman, CEF, Hughes
Research Laboratories, Malibu, CA
1 p.m._A Model of Copper Electrodeposition from
Cyanide Electrolyte
David A. Dudek & Dr. Peter S. Fedkiw, North
Carolina State University, Raleigh, NC
A theoretical model of copper deposition from cyanide electrolyte on
a planar electrode was developed to provide a quantitative framework
for investigating the deposition mechanism. The model describes mass
transport by diffusion and migration of all complexes formed by
cuprous and cyanide through a boundary layer near the electrode
surface, and allows investigation of the effects that varying
solution composition and electrode potential have on current density
and the concentrations of species at the electrode surface. Also
applied to chloride electrolyte as an alternative to cyanide, this
model is part of a larger program that aims to find bath formulations
that do not use cyanide yet yield current distributions of similar
uniformity.
1:30 p.m._The Role of Macro- & Microthrowing Power in
Metal Distribution on Small-scale Profiles & Discrete Cathode
Areas
Dr. Sergei S. Kruglikov, Mendeleyev University of
Chemical Technology & Dr. Elena S. Kruglikova, Institute of
Metallurgy, Moscow, Russia
Small-scale profiles and discrete cathode areas (printing wiring
boards, etc.) are typical cases where both macro- and
microdistribution phenomena may contribute to current and metal
distribution. A number of chromium and copper plating solutions with
various combinations of high and low macrothrowing power and positive
or negative leveling power will be studied, using profiled cathodes
and discrete disc and strip cathodes on a flat nonconductive plane.
Results will demonstrate the relationships between cathodes' geometry
and macro- and microthrowing characteristics of plating solutions in
actual distribution of the metal deposit over the cathode
surface.
2 p.m._Optical Precision Electroforms
Dongqing Cao & Darrel E. Engelhaupt, University of
Alabama in Huntsville, Huntsville, AL
The main difficulties in fabricating X-ray optics are that extremely
smooth surface finish and precise surface shapes for efficient X-ray
reflection and high resolution are required. In this research, we
selected silicon carthide (SiC) and indium-tin-oxide (ITO) to form
the smooth surface from which we obtained the electroform
reapplicated surfaces. High quality mirrors can be obtained if the
roughness generated during electroforming and mirror removal
processes is reduced. The easier fabrication process makes this
technique both attractive and applicable.
2:30 p.m._Dealloying Studies of Nickel Zinc Coating on
Steel
H.W. Pickering, M. Stein & K.G. Well, Pennsylvania
State University, University Park, PA
Zinc nickel alloys meet the criteria for dealloying, i.e., above a
critical potential, a planar alloy surface becomes unstable and the
oxidation reaction proceeds very fast under development of a highly
roughened surface. In this study, current transients after potential
jumps will be used to characterize the corrosion behavior of
Zn-11.5wt % Ni coatings on steel. It can be concluded from the
resulting measurements and subsequent metallorgraphic examination
that Zn-11.5Ni alloys show a behavior typical for dealloying systems:
There is a critical potential that separates a potential regime with
high corrosion resistance from one in which the occurence of pits or
cracks indicates high corrosion rates.
3 p.m._Nickel Electrodeposition from Methanesulfonic
Acid-based Baths
V.N. Kudryavtsev, S.A. Makeimenko & I.S.
Chernyshova, Mendeleyev University, Russia
A bath for deposition of stress-free nickel coatings based on
methanesulfonic acid has been developed. The characteristics and
properties of methanesulfonic acid nickel plating bath and coatings
with similar properties will be compared. The influence of the bath's
components, as well as electrolysis conditions of the range of
allowable cathodic current densities, current efficiency, bath
throwing power and properties of coatings (ductillity, internal
stress, porosity), will be outlined. Factors that affect coating
quality and mechanisms of cathodic process of nickel reduction will
also be addressed.
3:30 p.m._Intelligent Optimization System for Source
Reduction in Electroplating Plants
Dr. Y.L. Huang & K.Q. Luo, Wayne State University,
Detroit, MI
Source reduction-oriented optimization focuses on identifying areas
where waste is generated most, developing optimal operating modes,
and reducing costs. This paper will describe a computer-aided process
optimization tool for source reduction in electroplating plants. The
tool is part of an intelligent decision support system that can
accept plating process information, environmental expectation and
cost limitations. Two plating processes will be optimized to prove
the applicability of this tool and to demonstrate how a company can
achieve environmental goals with the lowest possible cost.
Session Chairman: Bob Kappler, Dynatronix, Amery, WI
1 p.m._An Effect of Pulse Plating Frequency on the
Hardness of Bright Copper Deposits
Dr. Mois Aroyo, Technical University & Dr. Dimitar
Stoychev, Bulgarian Academy of Science, Sofia, Bulgaria
Modern technology for the electronic engraving of gravure rolls
imposes specific hardness requirements for the electroforming bright
copper foils_the high initial values must remain constant for a
relatively long time. Hardness measurement has been performed on DC
and pulse-deposited copper coatings. The results will prove the
validity of using low-frequenmcy pulse plating with brighteners. This
mechanism predicts the occurrence of the maximum harness values at a
"limiting" frequency as a result of an optimal matching of the
process rates of nuclear formation, brightener adsorption and
incorporation into deposits.
1:30 p.m._Comparing Four Different Pulse Anodizing Processes
on Extruded 6063 Aluminum
Anne Deacon Juhl, M.Sc., & Dr. Per Moller,
Technical University of Denmark , Lyngby, Denmark
When anodizing 6063 aluminum, different pulse parameters can be used.
Over the years, various pulse wave forms have been suggested. Some of
them are squared pulse; others sinusoidal. The pulse time is another
parameter that can vary from milliseconds to minutes. All of them are
trying to improve the oxide layer one way or the other. In this
paper, four different pulse waveforms will be compared to see the
advantages as well as disadvantages. One of the interesting
properties of the oxide layer is the throwing power. The experiments
show that the throwing power of the oxide layer varies for the four
different waveforms. Also, the corrosion resistance and the wear
resistance of the waveforms are distinct from each other.
2-3:30 p.m._Demonstration of Pulse Plating Equipment
Session Organizer & Chairman: Dr. I-yuan Wei, AMP, Inc.,
Harrisburg, PA
8 a.m._Vapor Phase Corrosion Inhibitors
Cheryl Smith, Senson Corp., Ltd., Chandler,
AZ
Today's vapor phase corrosion inhibiting technology represents a step
forward in corrosion protection, enabling companies to clean and
inhibit at the same time. Each step in the finishing process is a
building block for the next. Neglecting or modifying just one of
these steps will result in consequences during the processing of the
material. This paper will investigate vapor phase corrosion
inhibitors (VPCIs) in the forms of coatings, cleaners and
emitters.
8:30 a.m._Effect of Resin & Additives for the
Lubricant-Coated Steel Sheet
Chan-Sup Park & Yong-Gyun Jung, Research Institute
of Industrial Science & Technology, Pohnag, Korea
Lubricating resin for zinc-coated steel sheets was developed for
application at in-line. It is mainly composed of epoxy-g-acrylate
copolymer, lubricant, colloidal silica, etc. This paper will
investigate the effect of epoxy on acrylate ration, the kind and
amount of lubricant, and the amount of colloidal silica on the resin.
Its quality will be characterized by friction coefficient,
anti-fingerprinting resistance, formability and corrosion resistance.
Coating weight, baking temperature, and cooling method will also be
taken into account when evaluating physical properties.
9 a.m._Improved Corrosion Resistance Obtained Through
Replacement of Chromium with Nitrocarburizing
Georg Wahl, Durkerrit GmbH Thermotechnick, Hanau,
Germany & Sharon Alwart, Degussa Corp., Ridgefield Park,
NJ
When combined with post oxidation, nitrocarburizing has proved
effective in overcoming corrosion problems. This thermochemical
treatment for metal surfaces has replaced chrome plating, obtaining
better results at lower economic and environmental costs. This paper
will explore several international case studies where the corrosion
resistance of automotive parts has been improved through this
process.
9:30 a.m._Self-assembled Monolayers (SAM) as a Molecular
Level Barrier for the Corrosion of Mild Steel
S. Bharathi, S. Rajendran, V.N. Loganathan, C. Krishna
& K.R. Anhandakumaran-Nair, Lucas-TVS Limited, Padi, Madras,
India
Molecular self-assembly of organo-sulfur compounds has now been
widely used in a variety of areas, such as molecular electronics and
nano materials. Recently, they have been tried to prevent the
corrosion of copper. Corrosion inhibition by these organized
mono-molecular assemblies on mild steel substrate will be discussed
in this work. Influence of chain length, coverage and the nature of
the tail group on the corrosion behavior of MS were also studied and
the results will be presented.
10 a.m._Experiences from Field Corrosion Test of Zinc &
Zinc Alloy Coatings
Dr. Per Moller & Dr. Peter Leisner, Technical
University of Denmark, Lyngby, Denmark
A number of zinc and zinc alloy coatings have been corrosion tested
in an accelerated field test where the test panels are placed in a
coastal area and are periodically sprayed with sea water. The test
included: Acid zinc, cyanide zinc, cyanide-free zinc, zinc-cobalt
0.8%, zinc-nickel 15%, tin-zinc 20%, and a proprietary zinc (hot
dip). To test the sensitivity of the different zinc and zinc alloy
coatings to galvanic corrosion panels in contact with aluminum,
stainless steel, copper and brass were included in the test.
10:30 a.m._An Accelerated Electrolytic Corrosion Test for the
CU-Ni-Cr Plating System on the Intricate Shape Details
Dr. Rustem A. Kaidrikov & Dr. Boris L. Juravelv,
Kazan State Technological University, Kazan, Russia.
In light of the results of accelerated and atmospheric corrosion
tests conducted in different conditions, a method has been proposed
for corrosion resistance prediction for Cu-Ni-Cr coatings.
Accelerated tests were performed by cyclic potentiostatic anodic
dissolution. The growth of the corrosion spots in the coatings was
estimated by the coulopotentiograms. A special electrochemcial cell
was constructed for testing intricate shape details. The digital
results of control corrosion resistance Cu-Ni-Cr coatings can be used
for statistical operation of technological processes.
11 a.m._Encasement: A Generic Approach for Corrosion Control
in Industrial Facilities
John Stahl, Preferred Solutions, Inc., Cleveland,
OH
Facility maintenance in plating, surfacing and finishing plants is
difficult because of the use of corrosive materials, such as
hydrochloric, sulfuric and nitric acids. The encasement approach
deals with spray-applying one or more materials, without surface
preparation, ranging from 5/8-in. to 6-in. thick. The finished
surface is an unsaturated polyester resin commonly described as
"fiberglass" resins well known for their excellent durability,
chemical resistance and weatherability.
Session Organizer & Chairman: Myron Browning, CEF, Matrix
Technologies, West Hills, CA
8 a.m._Effect of Additives on Zn-Ni Alloy
Electrodeposition
Hyun-Tae Kim & Young-Sool Jin, Pohang Iron &
Steel Company, Pohang-shi, Kyungbuk, Korea
Zn-Ni alloys were deposited in a chloride bath containing various
additives to investigate the influence of their anomalous behavior on
the electrodeposition. The effects of aliphatic alcohol, saccharin
and tamol on the Zn-Ni alloy composition and morphology were also
studied. The results will show that the Ni content of deposit was
increased by alcohol and saccharin but decreased by tamol. Also, the
structure of deposit was improved by adding tamol. The effects of
process parameters such as current density, flow rate and temperature
in the presence of the additives will also be discussed.
8:30 a.m._Performance Characteristics of Zinc Alloys
David Crotty & Robert Griffin, MacDermid, Inc.,
New Hudson, MI
Electroplated alloys of zinc with iron, cobalt or nickel are being
used to improve the corrosion resistance of the coating compared with
normal zinc coatings. Acidic and basic plating solutions are being
used to deposit these alloy coatings, resulting in a wide array of
choices for the electroplater and the parts designer. This paper will
explore the characteristics of the plating baths used to deposit the
zinc alloys and will describe the properties of the resulting
deposits.
9 a.m._Cadmium Replacement Through Zinc Alloy Technology: A
Customer-Supplier Joint Research Effort
Victor Waldman, Enthone-OMI Inc., Warren, MI &
Mark Barnes, Amphenol Corp.
Automotive corrosion specifications drove the early development of
zinc alloy plating with mil. spec. requirements for cadmium, fueling
the second phase of zinc alloy research. Cadmium replacement through
zinc alloy research encompasses many factors, such as a comparison of
corrosion results for various finishes, costs associated with
complying with current cadmium regulations vs. complying with zinc
regulations, and plating costs associated with both zinc alloys and
cadmium. Also important is the adaptation for commercial use of zinc
alloy applications that were originally employed as cadmium
alternative in mil. spec. requirements.
9:30 a.m._Alloy Alternatives to Hexavalent Chromium
Jeff Michael Szotek, Enthone-OMI Inc., Warren
MI
Recent environmental regulations mandating extensive testing and
equipment investments for hexavalent chromium electroplaters have
generated much interest in alternative processes for decorative and
functional purposes. Among the growing list of available technologies
designed to replace electrolytic chromium are a variety of alloy
electrodeposits. These alloy processes possess diverse physical and
operational characteristics affecting their suitability to specific
applications. Operation of several commercially available alloy
alternatives to hexavalent and the resulting deposit properties will
be described.
Session Organizers & Co-chairmen: Pat Scalera, CEF,
Parker-Amchem, Madison Heights, MI & Lee C. Branch, Albright
& Wilson Americas, Richmond, VA
8 a.m._Surface Finishing of Alluminum Alloy for Die
Cast
M. Yokoyama, K. Kaminaga & T. Sato, Shibaura
Technical University, Tokyo, Japan
A novel anodizing method has been developed where the alloy is
treated in a zincate bath for depositing zinc on aluminum alloy, and
the deposited zinc is heated in a furnace for diffusing zinc atoms in
the aluminum alloy. The method has yielded good corrosion resistance.
This new method and other popular procedures prevalent in Japan will
be introduced in this paper.
8:30 a.m._Internet WWW Server, "Anodizers' Plaza"
K. Kaminaga & T. Sato, Shibaura Technical
University, Tokyo, Japan
The authors have set up an information server called
"Anodizers' Plaza" on the Internet as of August 1995. The program
contains files titled "Anodizing News in Japan," "On-line Lectures,"
and "Links to Other WWW Servers." Anodizers from all over the world
are participating in the on-line discussions. The "Links to Other WWW
Servers" page provides useful links to other servers related to
anodizing science and technology. A detailed report on the Anodizers'
Plaza will be presented.
9 a.m._How to Use Casting for Surface Treatment (CAST) on
Sand Cast Aluminum Alloys
Anne Deacon Juhl, M.Sc. & Dr. Per Moller,
Technical University of Denmark, Lyngby; Dr. Leif Hojslet
Christensen, Danish Technological Institute, Tastrup, Denmark; &
Dr. Jean Rasmussen, Pioneer Metal Finishing, Green Bay, WI
It is more complicated to use CAST on sand-cast aluminum items than
it is to use it on pressure die cast items. In this paper, CAST will
be used on sand-cast aluminum items to look at the possibilities and
the limitations of the process. The image processing method will also
be discussed in detail.
9:30 a.m._Abrasive Wear-resistance of Pulse-anodized Aluminum
Alloys
Dr. Jean Rasmussen, Pioneer Metal Finishing, Green
Bay, WI
This presentation will contain results from abrasive wear tests on
various anodized aluminum alloys. The alumina tested have been
produced using conventional D/C at low temperatures and square waved
pulses at elevated temperatures. Pulse conditions are in accordance
with the Y-process. The discussion will also introduce initial,
post-, and compensated wear in order to understand the test results.
A new post-treatment process that results in a significant
improvement in abrasive wear resistance will be described.
10 a.m._A Reverse Pulse Process for Electrodeposition of
Aluminum
Dr. Wolfgang Fromberg & Sandy Donaldson,
AlumiPlate, Inc., Coon Rapids, MN
This paper will describe in detail an innovative process for the
electrodeposition of pure aluminum, as well as some of the properties
that the pure, electrodeposited aluminum can offer. Some of the
applications for the high-purity aluminum-plated surface will also be
discussed, including marine, aerospace, industrial and automotive
applications for purposes of corrosion resistance, cadmium
replacement, anodizability, brazability, high temperature resistance
and meeting high purity material needs.
10:30 a.m._Problem-solving Hints for Anodizing
Richard W. Mahn, Novamax Technologies (US), Inc.,
Atlanta, GA
There are many parameters that must be controlled to get good quality
anodized parts off the anodizing line. Normally, a presentation would
start at the beginning and talk in the direction of the work flow.
With this presentation, however, we will start at the end of the
line_the unracking area_because that is where the majority of
problems are observed. When a load does come out of unacceptable
quality, what can you do to determine what went wrong?
11 a.m._New Technologies for Coloring Anodized Aluminum
Dr. Xavier Albert Ventura, LC Systeme Iberica, S.A.,
Barcelona, Spain
The properties achieved by integral color anodizing of different
aluminum alloys will be studied. In a two-stage anodizing procedure,
the influence of alloy and solution composition, temperature and
anodizing conditions will be considered. The changes in color
parameters obtained with complex facing electrolytes will be
explained along with other coloring methods.
Session Organizer: Sue Packman, CEF, Hughes Research
Laboratories, Malibu, CA
Session Chairman: Dr. James Lindsay, General Motors
Research Lab., Warren, MI
8 a.m._Effect of Bath Stabilizers on Porosity of
Electroless Nickel Deposits
L. Das & D.-T. Chin, Dept. of Chemical
Engineering, Clarkson University, Potsdam, NY
A study has been made of electroless nickel (EN) deposition on
ferrous substrates in the presence of four bath stabilizers: Lead
ion, iodate ion, mercaptobenzothiazole and maleic acid. Deposit
morphology and spreading of EN to carbon inclusions in carbon steel
and cast iron were examined with SEM/EDS analysis. The porosity of EN
coatings was measured as a function of bath stabilizer
concentrations. It was found that the stabilizers retarded the rate
of EN deposition on carbon inclusions and increased the porosity of
EN coatings. Maleic acid decreased the phosphorus content of EN
coating.Sulfur and lead co-deposited in the presence of
mercaptobenzothiazole and lead ion, respectively. This paper will
summarize the results of these investigations.
8:30 a.m._The Effects of Electroplated Zn-Ni Alloys on
Inhibition of Hydrogen Permeation
Prof. B.N. Popov, D.H. Coleman & Dr. R.E. White,
Dept. of Chemical Engineering, University of South Carolina,
Columbia, SC
Hydrogen surface coverage, exchange current density,
absorption-adsorption reaction constant, and hydrogen recombination
were estimated on bare iron and on zinc and nickel-zinc plated iron.
Hydrogen evolution and permeation decreased with each successive zinc
layer until finally reaching an average decrease of 93 percent and 96
percent, respectively, as compared with bare iron. It was found that
the decrease in the permeation rate of hydrogen through the iron
membrane was the result of: (1) The decrease of hydrogen discharge
rate; and (2) the suppression of hydrogen absorption and adsorption
on the deposited zinc layers. The kinetic parameters obtained from
the model, along with the observation that permeation was decreased
even when the cathodic current was the same (at a given cathodic
potential), indicated that the decrease in permeation when
zinc-nickel is plated compared to bare iron is the result of a
decrease in the absorption of atomic hydrogen (shown by a decrease in
absorption-adsorption constant "k"). The kinetic parameters obtained
from the model, along with the observation that permeation was
decreased even when the cathodic current was the same (at a given
cathodic potential), indicated that the decrease in permeation when
zinc-nickel is plated compared to bare iron is the result of a
decrease in the absorption of atomic hydrogen.
9 a.m._Modeling the Zn-Ni Electrodeposition System_Electrode
Reaction Kinetics Calculation
M. Ranasubramanian, S.N. Popova, B.N. Popov and Dr. R.
E. White, Dept. of Chemical Engineering, University of South
Carolina, Columbia, SC
A mathematical model for the electrodeposition of zinc-nickel alloys
from sulfate solution was developed that takes into account the
various species existing in the plating bath and the reaction
kinetics occurring at the electrode surface. The composition of the
different ionic species present in the solution was calculated by
using the equilibrium constants, material balances and
electroneutrality for different values of pH of the solution. An
autocatalytic mechanism for the electrodeposition of zinc, which was
suggested in the literature, and an adsorption-reduction mechanism
for nickel were used in order to determine the composition of the
resultant alloy as a function of the concentration of different
species present in the solution and the deposition potential. This
simple model predicts the composition of the electrodeposited Zn-Ni
alloy and the partial currents of the individual electrode reactions
occurring at different deposition conditions.
9:30 a.m._Continuous Electroplating onto a Moving Resistive
Cathode
Huk Yuk Cheh & Lin Cai Cheh, Columbia University,
New York, NY
The primary, secondary and tertiary current distributions were
calculated for electroplating onto a continuously moving flat
electrode with finite ohmic resistance. The effects of electrode
resistance, electrolyte conductance, deposition kinetics, mass
transfer, and cell geometry on the uniformity of the metal
distribution will be discussed. Quantitative results on the deposit
uniformity over a wide range of the geometrical factor and process
parameters will be presented.
Note: This document contains the original schedule for this event, and is not a transcript of the actual proceedings. Contact AESF for copies of conference proceedings or further information.