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Strip to Strip Electroplating

2001

Dear all

I am working semiconductor solder plating area. Our plating machine is strip to strip plating. I met a problem, we found that there have exposed-copper at only one side leads shoulder (near the package). And we measure the thickness near the package found that this side thickness is much lower (about 100uinch) than the other three sides. How can improve the this side thickness?

Regards

Devis Lu
AMD(Suzhou) - SuZhou, China

Try increasing your anode to cathode distance or shield the edges with wire to draw current away from the edge of the lead.

Lise Bertsch
Vishay Thin Film, Inc. - Niagara Falls, NY
2001

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