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Copper/Nickel Alloy Plating is Brittle

June 19, 2012

Q. I am developing a Copper/Nickel alloy (98.5% Cu, 1.5% Ni.) The starting chemicals are Copper Sulfate pentahydrate, Nickel Sulfate hexahydrate and Trisodium Citrate as the complexing agent for the co-deposition. So far I have achieved the correct composition, but the alloy is very brittle. I am using an insoluble anode and no additives (as yet).

Can you explain the cause of the brittleness and how to correct it. The pH of the mixture is approx. 4-5. I am doing a potentiostatic deposition and according to my CV scan, the potential I am using should not cause excessive Hydrogen evolution.

Does anyone have any suggestions how to solve this problem

Maurice Mason
Plating Consultant - Danbury, Connecticut, USA
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July 21, 2012

Can someone help me with this problem? A response either way would be greatly appreciated.

Thanks,

Maurice Mason
Consulting - Danbury, Connecticut, USA


July 25, 2012

A. Hi Maurice!

Copper and nickel form a solid solution completely across the phase diagram- they don't form any weird crystal structure or intermetallic compound that would account for any brittleness. I wouldn't think that would happen, so I agree with your surprise that it is!

If I were faced with this problem internally, I'd examine the broken plating chips with my SEM, looking for intergranular fracture- and if I found it I'd try to see what was on the grain boundaries that might make the plating fracture there. I normally wouldn't consider hydrogen, since it shouldn't embrittle copper as it does steel, but I'd keep it in mind as a convenient scapegoat. I'd use the EDS part of the SEM to look for other elements, but EDS is only going to find them if they are say, more than 1%. It's certainly possible something like selenium or arsenic might be on the grain boundaries, embrittling them, and I'd never see it.

I'd also mount and polish a sample, and look at it metallographically, as those are the tools readily available in our lab. That would show what geometry grains I was getting- long, or blocky, or equiaxed, etc- and that might shed some light on the issue.

If you want to send me a sample, I'll take a quick look. Ted has my contact info, but I'm not hard to find anyway.

Good luck!

Lee Gearhart
metallurgist
East Aurora, New York


August 12, 2012

A. Hi Maurice
Alloy baths are often difficult to develop but you seem to be on the right lines.
I would suspect organic contamination. Even if you are using good lab grade chemicals, plating solutions are very sensitive. Treat with hydrogen peroxide then carbon treat and filter. Run this bath at about 55 °C and pH5.
I would abandon the potentiostat. Current density is the controlling factor and about 20 amps per sq ft is about right here. A constant current rectifier is useful, constant voltage is largely irrelevant.
A word of caution with published phase diagrams. They are derived from normal metallurgical practice i.e melted mixtures. Alloys formed by deposition at near room temperature may not conform. In fact it is possible to deposit some alloy ratios that cannot be made by melting.
The remaining problem could well be internal stress in the deposit which can reach impressive height.
Possible additives are saccharin c. 0.5 g/l or thiourea at about half that.
Good luck

Geoff Smith
Hampshire, England


Electrodeposition of Alloys

Abner Brenner

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