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-----NiCl2 vs MgCl2 in a Nickel speed bath
January 26, 2010
Dear all,
Can anyone tell me reason to change from NiCl2 to MgCl2 content in a Nickel Sulphamate bath?
The main reason I hear is related to less tensile stress. Is there any other? (formation of contaminants, brittleness, etc)?
What would be the correct choice for the wetting agent, Sodium Lauryl sulphate? Which concentration? Any other suggestion?
I'm working with depolarized S anodes, 600 g/l Ni sulphamate and 38 g/L boric acid.
Thanks for your support.
Best regards,
Engineer - Portugal
February 7, 2010
Chloride in any form causes tensile stress. However, chloride is necessary to help dissolve the anodes and keep them from polarizing. Magnesium chloride causes less stress than nickel chloride by only a small amount.
Sodium Lauryl sulphate is OK to use. O.3%. Keep other impurities out of the nickel.
Low Current dummy plating, 5 amps/sq ft. using a corrugated clean steel cathode, used periodically. The typical is 90 degrees corrugations of 3-6 inches deep. (dark streak at the low CD ares in a Hull Cell ⇦ huh?
will tell you when to dummy plate)
Don Baudrand
Consultant - Poulsbo, Washington
(Don is co-author of "Plating on Plastics"
and "Plating ABS Plastics" eBay or AbeBooks affil links])
February 7, 2010
I made a mistake in the sodium lauryl sulphate recommendation. It is a powder used at 0.4 g/L in nickel sulfamate plating solutions.
Don
Don Baudrand
Consultant - Poulsbo, Washington
(Don is co-author of "Plating on Plastics"
and "Plating ABS Plastics" eBay or AbeBooks affil links])
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