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Copper Migration Through Sulfamate Nickel Plating

I have a requirement to electrolytically apply sulfamate Nickel plate over copper to a min thickness of .0002. The application is required to last 50 years. We are already seeing copper migration on the surface of the copper after less then 6 months. I have two questions. Is this plating process appropriate for the required application? Is the plating two thin without a nickel strike?

Daniel Brown
Manufacturer and plater - Rochester, New York
October 2, 2008

October 8, 2008

Daniel,
Two tenths of a mil nickel thickness does not seem thick enough to last 50 years, with or without a nickel strike. You may want to find out if the spec is accurate and make sure your plated thickness is also accurate. For example, spec AMSQQN290, class 1, grade SD, thickness grade G is the lowest thickness in the spec @ .0002. Even with a thickness of .0002, you should not see migration within 6 months however. You may find that you will have to follow engineering plating specifications for this particular part.

Mark Baker
Process Engineer - Syracuse, New York

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