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Matte tin plated over copper wire faced de-wetting problem

August 19, 2008

Hi, I'm doing matte tin plating over copper based wire dia. 1 mm.
Tin thickness control at 12-15 µm. I performed 245 degree c MUST II wetting balance test & found difficult to achieve zct ( zero cross time) within 2 sec.
Actually even never reach ZCT.
Sample went through dry aging test 155 °C , 16 hours.
Flux use non-clean flux.
Solder globule: SAC: Sn 96.5 Silver 3% Copper 0.5%
Dipping time: 5 sec
Wire Immerse Depth: 10 mm
Speed: 20mm/sec
Anyone can help me improve the wettability performance for wire?

Vincent Loh
Plating shop - Malaysia

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