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How to prevent Ni/Au p-contact from peeling off when bonding?

I am doing device processing of GaN-based LEDs. I did 10/10nm Ni/Au on p-GaN using e-beam evaporator and then put 30/300nm Ti/Au as bond pads. But when doing bonding, both Ni/Au and Ti/Au were peeled off. I have improved the surface cleaning but that does not work. Who can tell me some tricks about how to stick Ni/Au to p-GaN?

Jie Bai
University of Sheffield - UK
2006

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