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Letter 41022
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Jeffrey Holmes,
CEF |
You do not say what your pH is or how hard it is to control. My guess is that you do not have enough anode area or it is passivating. High speed requires extreme agitation, how is yours?
James Watts
- Navarre, Florida
Hi Kurt,
You share a problem that many high speed Ni Sulfamate platers have in
common. The secret I have found is to reach the proper halogen level
(chloride). It's really a catch 22 because too much chloride can
raise tensile stress, and too little polarizes the anode, causing
ammonia to form. The formation of ammonia in the bath will make the
deposit brittle. You are using sulfurized anodes, so the low
concentration of Ni chloride seems to be the norm. I know of a few
high speed plating customers that went to magnesium chloride for a
halogen. It is less likely to increase tensile stress, and it can be
maintained at a slightly higher level than Ni chloride helping with
anode corrosion. You could check with your supplier to see if they
concur on using magnesium chloride, or maybe they would suggest
raising the Ni chloride a little bit in the bath. Also consider the
use of a stress reducer. Good Luck!
Mark Baker
Process Engineer - Syracuse, New York
I'll bet you have more than 600 ppm ammonia. Ammonia causes brittleness and is caused by, high anode current density, low pH, high current density, high temperature and 140 is worse 5than 120 F, and sulfamic acid that contains ammonia to start with. Do a distillation on the incoming sulfamic acid. It is very difficult to find ammponia free sulfamic acid on the open commercial market. Also, your chloride is too high.
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Robert H Probert Editor's
note: |
The decomposition product of sulfamic acid are sulfuric acid and
ammonia.
How is your anode efficiency? It should be same as your cathode
efficiency. If it is less, then you are probably generating sulfamic
acid from Nickel sulfamate and electrolytic decomposing it.
You are probably using anode basket?
Try depolarized Nickel anode bars,use good anode bags, this might
help prolong the life of your bath.
2005 Metal Finishing Guidebook &
Directory pp.209 & pp. 224
has a good write-up on Nickel anode efficiency.
Hamilton Solidum
- Mays Landing, New Jersey
I thank everyone for their responses. All my research has
indicated that ammonia causes stress in the plate, is this correct?
Unless I have my chemistry wrong, the sulfamate breaks down into
nickel sulfate and ammonium sulfate. Would not high sulfate be an
indicator of high ammonia?
I am concerned about our pH levels, currently 2.9-3.4., not too
difficult to control. We measure twice a shift and add sulfamic acid
about once a day.
I have tried using no NiCl since we are using S-rounds, it was a
disaster. Will discuss MgCl with my vendor. My inclination now is to
lower the temperature and raise the pH some. What is a good level for
the pH?
Kurt Sammons
- Inman, South Carolina
pH 3.6 - 4.0, Temperature 105F, 1.5 oz/gal nickel bromide, no chloride.
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Jeffrey Holmes,
CEF |
S-Rounds are far better for sulfamate than rolled depolarized because they dissolve with less current and hence make less ammonia. Your pH is too low, low pH makes ammonia,let it rise to 4.0 and hold 3.9 to 4.2. High temp also makes ammonia, try to run at 120 F. High anode current density makes ammonia.
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Robert H Probert |
I have studied it but never ran a high speed sulfamate bath, only conventional and brush. Also, you already have too good and educated answers. But in my opinion you should have your defective plated wire analyzed by a well equiped and professional lab, not just the bath. There are too many things that can go wrong and raise the stress, from operating conditions to draged-in or by-product substances. Fortunately, most will leave a track to follow in the plate. Good luck.
Guillermo Marrufo
Monterrey, NL, Mexico

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