Letter 40091

Leveled rhodium for electronics industry [Oregon] 

March 28, 2006

Hi...I'm trying to get information on how to achieve bottom up plating or "superfilling" of small via structures. Has anyone used additives in Rhodium bath to accomplish this?

David Clarke
electonics mfgr - Beaverton, OR, USA

I haven't heard of anything but copper being used for that yet, David. Hopefully, someone else has.

 
Ted Mooney, P.E.
finishing.com Inc. - Brick, NJ

Try Pulse plating ... you have to play around with duty cycle to get the desired fill. Normal Forward pulse will do, but reverse pulse will be a better option too.

Karthik Thambidurai
- Austin, TX

I want to answer or follow-up on this subject publicly (in non-commercial fashion).

 

I want to post a new question or inquiry of my own on a different subject.