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Electrolless Ni adhesion problems on Si wafers

Hello everybody,
I need technical advice in electrolessless nickel plating on silicon wafers. currently we're dealing with poor nickel adhesion to the silicon substrate (in other words the nickel silicides formed on the wafer's surface are spotty). any advice/guidelines in fixing this problem would be greatly appreciated.

Thank you in advance,

Florin Neidoni
electronics mfgr. - Des Plaines, ILLINOIS, USA
2004

Florin, I have the same problem with electroless Ni deposition on Silicon.

Have you already got your question answered?

What chemistry are you using?

Regards,

Alex Berger
TruSi Technologies - Sunnyvale, California
2004

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